Summary
Overview
Work History
Education
Skills
Top Achievements
References
Timeline
Generic
ZAIMI BIN ZUL @ AZHAR

ZAIMI BIN ZUL @ AZHAR

Process And Equipment Engineer
Perai,07

Summary

Experienced Process and New Product Introduction (NPI) Engineer specializing in photolithography. With 2 years at Ibiden Penang and over 5 years at Unisem Ipoh and Intel Penang, strong background in process engineering. At Intel, focused on tool qualification with the USA litho team, specifically working on the TEL-ACT12 tool and the anti-reflective coating chemical process. Then, transfer this technology from USA to Malaysia. At Unisem, I led tool qualification for a new site main tool and provided support for supporting tools, also playing a key role in yield improvement projects at the existing site. Collaboration is essential to my role as I closely work with production, QA, and maintenance teams, as well as vendors. Additionally, I have a passion for writing research papers and documentation.

Overview

7
7
years of professional experience
5
5
years of post-secondary education

Work History

Process and Equipment Engineer (Litho Process)

Intel Malaysia (Penang)
5 2022 - Current
  • Pioneer for Litho Process as Equipment and Process Engineer, major in TEL ACT12 tool for Malaysia site (300mm wafer fab).
  • Working for 1 year at Intel USA with the New Mexico (USA) team on setup and qualified coating process for production and sustaining phase.
  • Working with different teams such as tool vendors, chemical suppliers, TEL specialists and other Intel sites in order to qualify the tool in NM.
  • Carry out further process optimization through DOE run to develop a matching with Intel reference site
  • Completed TEL Japan training for equipment basic training (involving PM and setup, such as robot teaching and positioning teaching).

Process Engineer (Descum Process)

Unisem Group (Ipoh)
09.2019 - 05.2022
  • Responsible for qualifying new machines for Descum, Cure and bake oven machines for new site 8-inch and 12-inch wafer size.
  • Involved sets of testing and qualifying wafers and discussion with vendor for machine performance optimizations.
  • Prepared packages for internal review, customer review, documentations for machines such SOP, PS, FMEA, OCAP etc.
  • Training operator and training department to ensure they get familiarize with new machine's operation procedure.
  • Besides, involved in existing production line improvement for yield and process capability such as etch removal uniformity study, recipe for curing improvement with FTIR macro file setup and SPC implementation.
  • Support for other process improvement for skills development.

New Product Engineer (NPI)

Ibiden Electronics Malaysia (IEM)
05.2017 - 09.2019
  • Assisted prototype in the patterning process, which involves PCB exposure, development, chemical etching, and AOI inspection, to ensure on-time delivery (OTD) with good quality can to achieve.
  • Setup program for Automated Optical Inspection (AOI) and checking PCB board design by using AOI machine.
  • Own a few products for some customers.
  • Cross-functional department collaboration on the issue encounters triggered from the patterning process with multiple teams such as production, quality, process improvement, and maintenance for improvement.
  • Deal with production side on sudden issue arises during lot running at exposure and AOI in case of changes.

Education

Bachelor of Engineering (Honors) Materials -

Universiti Malaysia Perlis (UniMAP)
09.2012 - 06.2016

Foundation in Science (Asasi Sains) -

Universiti Teknologi MARA (UiTM) Puncak Alam
05.2011 - 06.2012

Skills

Microsoft Office (Excel, Words, PowerPoint and Outlook), JMP 14, Minitab 17, ViewMate, Statistical Process Control, QC 7 tools, FMEA, Lean Six Sigma Methods, Continuous Improvement, Problem-Solving, Process Improvement, Root Cause Analysis, Safety at workplace

Top Achievements

  • Defining the photochemistry microflow for the greenfield fab with details on flow from warehouse until docking into storage area.
  • Proactive Chem/Gas Inventory Management Resulting in $1.26M Cost Avoidance. Took proactive action by reviewing chemicals and gases before the Q1 Long Range Plan updated, creating strategies to mitigate the risk of expiring inventory. Efficiently negotiated with suppliers to re-route to other sites, cancel POs, and hold without penalty, preventing $1.26M in wasted spending due to expired materials.
  • Finalist for Technical Excellence 2020 (TE) competition in Unisem Ipoh.
  • Six Sigma Alcon project on reduction of airborne particle control at Plasma cleanroom.
  • Dean list for Materials Engineering (1st, 2nd, 6th, 7th and 8th semester).
  • Proceeding paper in International Conference at Electronics and Green Materials (EGM2016) at Phuket Thailand and X-ray and Related Techniques in Research and Industries (ICXRI 2016) at Nuclear Malaysia.

References

  • Eric Teo Ken Yong, Department Manager (Lithography), Intel Penang +60 12 889 1575
  • Eric Baker, Module Manager (Lithography), Intel Penang, +1 480 274 6336
  • Shiraz, Principal Engineer (Lithography, Intel Penang+60 18 233 1152

Timeline

Process Engineer (Descum Process)

Unisem Group (Ipoh)
09.2019 - 05.2022

New Product Engineer (NPI)

Ibiden Electronics Malaysia (IEM)
05.2017 - 09.2019

Bachelor of Engineering (Honors) Materials -

Universiti Malaysia Perlis (UniMAP)
09.2012 - 06.2016

Foundation in Science (Asasi Sains) -

Universiti Teknologi MARA (UiTM) Puncak Alam
05.2011 - 06.2012

Process and Equipment Engineer (Litho Process)

Intel Malaysia (Penang)
5 2022 - Current
ZAIMI BIN ZUL @ AZHARProcess And Equipment Engineer