Summary
Overview
Work History
Education
Skills
Accomplishments
Timeline
Generic
VELASEENI SATHIYANATHAN

VELASEENI SATHIYANATHAN

MANUFACTURING ASSOCIATE 4
Bagan Serai,08

Summary

To work in an environment which encourages me to succeed and grow professionally where I can utilize my skills and knowledge appropriately.

Overview

10
10
years of professional experience
2015
2015
years of post-secondary education

Work History

Manufacturing Associate 4

Dexcom Malaysia
Perai, Penang
04.2023 - Current
  • Currently taking care of FASTr 9 and FASTr10 in CERP2
  • Holding PBA cert of Island 1, Island 2, Island 3 and TVL
  • Managing tasks such as update HC attendance, update WIP status for all islands
  • Communicate with Supervisor for material loading plan, headcount plan and machine downtime
  • Instruct MA3, MA2 and MA1 to perform CAMSTAR execution and material loading prior to lot start-up
  • Able to use software such as AVEVA, HMI, CAMSTAR and APEX
  • Take CED reading and update report for every 2 hours
  • Review LHR report, monthly PI count, request WOOR from process tech before sending WIP to kitting
  • Able to do lot sorting, lot verification, reject sampling lot when necessary

Production Lead

Micron Memory Malaysia Sdn.Bhd
Perai, Penang
05.2019 - 03.2023
  • PNP - preparing feeders setup, pick and place referring from FSR program recipe (FOL)
  • AOI - capture FAIL & REJECT component via automated optical inspection (FOL)
  • AE - running auto enclosure according to part number in traveler. Resume machine from multiple errors from machine down. Arrange enclosure by traveler for quality inspection (MOL)
  • IBIR - assign lot by lot to intelligent burn in rack for software installation. Scan serial number and load into tester. Unload PASS drive's and separate the FAIL drive's. Perform check lot system to separate PASS & FAIL. ENDSTEP in MAMBRIDGE system to end the process (BOL)
  • ADVANTEST - load the drive's to check and validate the components (BOL)
  • IN-LINE INSPECTION - check components traveler vs lots. Scope inspection to capture damaged component. Label inspection to capture damage. Arrange drive's by traveler, lots and tray before send to QC (BOL)
  • MA - Manual attach perform rework follow by remove damage labels and change the damage enclosure (BOL)

Quality Assurance

Sanmina-SCI Systems Sdn.Bhd
Perai, Penang
03.2017 - 02.2019
  • Take PCB board from production and placed into IONIC water to get the reading for good quality and separate low reading board for scrap
  • Prepare daily report for PCB inspection

Quality Control

Optics Balzers Malaysia
Perai, Penang
06.2015 - 01.2017
  • Perform scope inspection to capture bubble, scratch, thickness and blackspot

Education

Sijil Kementerian Malaysia - Beauty & Spa

Kolej Komuniti Taiping
Taiping, Perak, Malaysia

Skills

Accomplishments

Completed 1 month of training at Micron Singapore (SG)

Timeline

Manufacturing Associate 4

Dexcom Malaysia
04.2023 - Current

Production Lead

Micron Memory Malaysia Sdn.Bhd
05.2019 - 03.2023

Quality Assurance

Sanmina-SCI Systems Sdn.Bhd
03.2017 - 02.2019

Quality Control

Optics Balzers Malaysia
06.2015 - 01.2017

Sijil Kementerian Malaysia - Beauty & Spa

Kolej Komuniti Taiping

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VELASEENI SATHIYANATHANMANUFACTURING ASSOCIATE 4