Thilaga Vaani Nagalingam
Kuala Lumpur
Summary
Motivated and passionate Operation Quality Engineer with 18 years of experience in Semiconductor Assembly Backend, Manufacturing Quality, Process Development, and Quality Culture Transformation. Skilled in reducing costs, troubleshooting quality issues, and optimizing production in BGA and QFP Back End Assembly. People-oriented engineer known for thoroughness, commitment, persistence, and consistently meeting high expectations. Fast learner who embraces change and drives innovation projects with enthusiasm.
Overview
19
19
years of professional experience
1
1
Certification
Work History
Assembly Back End Operation Quality Driver
NXP Malaysia Sdn. Bhd
03.2020 - Current
- Company Overview: Semiconductor Manufacturer
- Operation Quality Driver. Work in a leadership capacity to driver for excellence quality indices Assembly Backend covering both Leaded and BGA production line.
- Lead quality improvement projects focusing zero assembly escape, excursion and supports activities by reviewing and ensuring all customer concern on processing and control requirements are met
- Lead quality firewall projects to protect the customer and early detention in abnormality
- Project Lead for Assembly Backend for CDMS (Critical Down Code Management System), RDD (Repeated Defect Detection) and RMS (Recipe Management System)
- Lead Operation team to resolve customer quality issues, and establish corrective and preventive action.
- Work with Equipment, Process Engineer and Manufacturing to resolve internal quality issue, establish corrective and preventive action
- Core person to drive quality related issue on test feedback
- Pro-actively work on data analysis to identify quality projects potential to lead the team to achieve the zero Low Tech issue
- Audit the effectiveness of the committed customer actions to meet Zero Defect
- Audit the effectiveness of IATF (International Automotive Task Force), GMA (Global Manufacturing Assessment) and customer audit findings.
- Audit the effectiveness on process Control Plan, FMEA, EFMEA and OCAP.
- Core team member for Control Plan and FMEA
- Review any process change, new equipment buyoff through CAB (Change Action Board) process.
- Lead the team on the routine quality non-compliance audit
- Final Stage Approver for New Hire for Direct Labor (Operator)
- Department coordinator for IATF Audit, GMA Audit and Customer Audit (Automotive and Non-Automotive Customers)
- Review the final 8D report, 3x5 why for customer CQC and containment
- Final reviewer/approver on customer shipment for non-conformance material
- Awarded Bronze under Technical Excellence Award (TEA) for Elimination Reflow Tray as part of Quality and Cost Saving Project (Saving of RM 282K yearly)
- Implemented in-line QA buyoff procedure for Trim & Form, Mold and X-Ray Processes.
- Implemented system CDMS (Critical Down code Management System) as part of firewall detection at mold process to achieve zero critical defect escape
- Implemented RDD (Repeated Defect Detection) at Open Short Process as part of firewall detection and early containment.
- Implemented RMS (Recipe Management System) to all the Backend Assembly machines to prevent critical parameter tampering.
- Champion to lead department IATF 16949:2016 & Customer Audit and lead the team successfully with zero compliance finding
- Mixed Device Task Force Department Champion to drive systemic root cause fix and preventive actions on mixed device complaints.
Senior Process Engineer
NXP Malaysia Sdn Bhd
08.2018 - 02.2020
- Company Overview: Semiconductor Manufacturer
- Define the process control for this process.
- Responsible for Yield Improvement for process defect
- Qualify new production machine.
- Team Leader to drive the Double Ball Defect through DMAIC approach.
- SPC Champion for Solder Ball Shear and Coplanarity.
- Establish new control limit for Solder Ball Shear and Coplanarity.
- Global document core team member for solder ball shear.
- Handle customers’ complaints with care and react accordingly to customers’ requirements
- Process Owner for FMEA and Control Plan review.
Senior Process Engineer
NXP Malaysia Sdn Bhd
11.2006 - 08.2018
- NXP acquires Freescale Semiconductor Sdn, Bhd in Year 2015
- Yield Lead for PBGA, MAPBGA and TBGA (BGA Back End) responsible for Yield plan/target setting proposal
- Responsible to drive the yield improvement and interface for BE yield lead
- Pro-actively work on data analysis to identify yield gain potential to lead the team to achieve the yield target
- Establish final yield break down with detailed data analysis to identify yield gain potential along with the process chain (Mold, Ball Attach, Singulation and Front End Assembly related defect)
- Lead yield review with regular meetings within operation & provides input to the segment and cluster yield reviews
- Running the yield improvement projects on demand, establish team structure for all related projects
- Maverick lots detection/handling, analysis, disposition & improvement against reoccurrence, address issues to Front End Assembly and Substrate Supplier related yield loss.
- Perform analysis and structured the problem solving on yield and performance issues
- Key person in charge for test feedback on the Visual Mechanical escapee from assembly
- Working with relevant BGA backend groups and equipment engineers to solve the technical process and the defect issues detected by test department.
- Work closely with the process groups to improve and resolve the process/product interactions
- Work diligently with Supplier Quality Engineer to improve and resolve substrate supplier visual mechanical defect for improvement.
- Technically lead work packages within yield Improvement projects and decide on priorities
- Drive activities and analyzing the project with outstanding results in a very short time
- Gain technical on know-how and accept towards the high level of expertise in BE yield management
- Drive and initiate system improvements for automated yield reporting, yield deviation detection & yield process governance Lead the Customer Quality Complaint for investigation and corrective actions for BGA Substrate Crack
- 8D report Leader for BGA Substrate Crack.
- Identify/drive opportunities for improvement through structured problem- solving methodologies for BGA Crack throughout cross functional team.
- Subject Expert Matter for BGA Substrate Crack
- Overall BGA Back End Customer Audit Lead
- Overall BGA Back End GMA Audit Lead
- Qualify new machines in production floor
- Provided the operations with instruction on manufacturing methods, assembly instructions, rejects disposal and all other technical guidance as deemed necessary
- Maintained surveillance on the operations health by way of key indices in the form of fixture downtime. Process yields, DPPM’s, CPK’s etc. and to react to any abnormalities display by the said indices.
- Substrate Crack Elimination DMAIC Leader in 2012.
- Overall BGA Back End yield improvement that leads to 99.86% yield in Y2015.
- PBGA yield improvement that leads to QoQ 70% yield gain.
- MAPBGA yield improvement that leads to QoQ 50% yield gain.
- TBGA yield improvement that leads to QoQ 47% yield gain.
- Successfully implemented tray carrier in Y2011 to replace the packing box as a internal media carrier. Bravo received as a recognition.
- Implemented the barcode scanning to eliminate wrong packing label.
- Successfully implemented the security control in BGA Assembly thus enable ATKL qualified to run security product in Y2017 – Bravo received as a recognition
Education
Master of Engineering - Manufacturing
University of Malaya
03-2005
Bachelor of Engineering - Computer Aided Design and Manufacture
University of Malaya
03-2003
Skills
- Certified IATF 16949:2016 lead auditor
- Experienced in continuous improvement
- Strong problem-solving and analytical skills with the ability to analyze data, identify trends and formulate proposals (DMAIC/LEAN/JMP/MINITAB/SPC/8D/FTA/Fishbone diagram/Forte Tree Analysis & PDCA)
- Knowledge in operation and technical of Ball Attach process, Auto Optical Inspection (ICOS SCAN) process, Final Outgoing Inspection for BGA (Ball Grid Array), Assembly Packing process
- Department representatives to lead all the Quality Related Issue
- Quality Management System with Automotive Core Tools (APQP, PPAP, MSA, SPC, PFMEA)
Certification
- IATF Lead Auditor Certified
- Six Sigma Yellow Belt
- Make A Difference (M.A.D)
- Creative Thinking, Problem Solving & Decision Making
- Stand Up & Speak
- Process Control and Capability.
- Measurement System Analysis (MSA)
- Advance FMEA Program
- JMP Statistical Software/Minitab Software.
- Poke Yoke system
- Design of Experiment( DOE)
- Lean Manufacturing
- Geometric Dimensioning and Tolerance
- Statistical Process Control
- Gauge of Reproducibility and Repeatability (GR&R) and Process Capability (Cpk).
- Leadership And Management Skills
- Project Management Skills
- A Practical Approach to Cleanroom Technologies
- Statistical analysis and tooling design/optimization.
- 8 steps Problem Solving & Decision Making
- Microsoft Office (Excellent skills)
- Power BI
References
Available upon request
Strength
Flexible on long working hours to meet projects timeline and business trips in short notice
Languages
English
Advanced (C1)
Malay
Advanced (C1)
Tamil
Upper intermediate (B2)
Timeline
Assembly Back End Operation Quality Driver
NXP Malaysia Sdn. Bhd
03.2020 - Current
Senior Process Engineer
NXP Malaysia Sdn Bhd
08.2018 - 02.2020
Senior Process Engineer
NXP Malaysia Sdn Bhd
11.2006 - 08.2018
Master of Engineering - Manufacturing
University of Malaya
Bachelor of Engineering - Computer Aided Design and Manufacture
University of Malaya