THEVERRAAJ KARUPPIAH

• Work with a global leader in the field of high-end printed circuit board (PCB) and integrated circuit (IC) substrate manufacturing.
• Main focus on Kulim Greenfield Plant Qualification
• Plan & execute on plant, tool, process, product qualification & reliability test.
• Lead NPI team, coordinating across functions for successful product launches.
• Maintain consistent customer communication.
• Enhanced communication between departments, fostering a collaborative work environment for efficient project execution.
• Identify and implement improvements in key processes: Mechanical, Lithography, Plating, Solder Mask, Assembly, and Test.
• Key Achievements:

1) Coordinated Plant and Tool Readiness and get approval from customer to run qualification sample (Cleanroom & TQPQ report completion)

2) Implemented Technology Transfer from Chongqing, China to Kulim, Malaysia.
3) Completed1st qualification lot build and delivered to customer ahead of 1 week.

• Enhanced communication between departments, fostering a collaborative work environment for efficient project execution.
• Reduced product launch timelines with effective resource allocation and streamlined processes.
• Managed stakeholder relationships, ensuring expectations were aligned with realistic project goals and delivering consistent updates on progress.
• Collaborated with engineering teams to optimize product designs for manufacturability while maintaining adherence to quality standards.
• Delivered successful NPI projects by coordinating cross-functional teams and implementing best practices in program management.
• Maintained open communication by presenting regular updates on project status to customers.
• Generate phase review reports, qualification reports and LVM reports and present them to customers.
• ECN management with the use of Agile portal.(Inform and delegate tasks to the related parties if not related to NPI)