Summary
Overview
Work History
Education
Skills
Timeline
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Tee Kok Chen

Tee Kok Chen

Process Manufacturing Engineer (PR Singapore)
Singapore

Summary

Present: Process Manufacturing Engineer in ASMPT to sustain efficient operation of SIPLACE placement machines. Proven ability to implement process improvements, enhance machine performance, and optimize production workflows for maximum efficiency and cost-effectiveness.


Previous: Former Field Process Engineer from LAM RESEARCH supporting Micron Semiconductor memory account in dielectric dry etch process recipe development and productivity.

Overview

8
8
years of professional experience
4
4
Languages

Work History

Manufacturing Process Engineer

ASMPT SMT Singapore Pte Ltd
06.2023 - Current

Lead and Optimize Manufacturing Processes for Semiconductor Equipment:

  • Designed, developed, and optimized manufacturing processes for assembly and packaging of SMT tool and jjig, ensuring high throughput with minimal cost.
  • Identified opportunities for process improvements and implemented solutions to increase efficiency, reduce costs, and enhance product quality.

Troubleshot and Enhanced Production Yield:

  • Conducted root cause analysis for production issues and led initiatives to troubleshoot and resolve challenges in assembly lines, improving overall production yield.
  • Collaborated with quality management team and FSE to ensure that new process improvements aligned with product requirements and customer specifications.

Developed Process Documentation and Standard Operating Procedures (SOPs):

  • Created and maintained detailed process documentation, including work instructions, process flowcharts, and control plans, ensuring alignment with industry standards.
  • Trained production staff and operators on new processes, ensuring adherence to best practices and compliance with safety and quality standards.

Monitored and Managed Process Control:

  • Utilized process control systems and data analytics tools to monitor manufacturing performance, identify deviations, and implement corrective actions.
  • Ensured that processes were optimized to meet customer specifications while adhering to strict regulatory and environmental standards.

Involved in TX and XS Product Transfer

  • Managed the transfer of critical manufacturing tools and jigs between SGP and MY, ensuring that they were properly calibrated and aligned with production requirements.
  • Collaborated with cross-functional teams, including engineering, quality assurance, and production teams, to ensure smooth tool and jig transfers.
  • Work with QM team to audit for the series production readiness as per project milestone deadline.

Field Process Engineer

Lam Research Pte Ltd
04.2021 - 03.2023

Led Process Transfer for 160s Slit and 150s Pillar FOAK Tools:

  • Successfully transferred processes between Boise Fab4 and Singapore Fab10.
  • Managed hardware configuration fingerprinting and process scorecard matching to ensure smooth transition and alignment across fabs.

Led Process Tool Installation Teams for Advanced Etch Machines (VantexB, HX+/HXE):

  • Oversaw process qualification and tool startup, ensuring adherence to timeline and production requirements.
  • Delivered training to memory teams and BOF teams on Process Technical Integration Qualification (TIQ).
  • Presented Process Release Documents (PRD) to customers, addressing and resolving process bottlenecks, ensuring machines met production in-service dates.

Collaborated with Stakeholders to Develop and Optimize 160s Slit Project Scorecards:

  • Reviewed process data and devised action plans for continuous improvement.
  • Engaged with customers to assess and enhance inline results, driving process scorecard improvements.

Worked Closely with Product Groups to Improve 4C Slit Etching Process Metrics:

  • Built and executed Design of Experiments (DOE) and simulations to fine-tune process-sensitive parameters.
  • Optimized real processing time (RPT) to enhance production WIP and sustain Mean Time Between Clean (MTBC) RFhr, ensuring a high level of process efficiency and performance.

Field Process Engineer

G and B Semiconductor Pte Ltd
01.2017 - 04.2021
  • Supported Plasma Etch and Deposition Systems at Micron Fab10N/X/A, ensuring smooth equipment startup and process integration.
  • Worked with the account team to qualify 120s, 130s, and 140s dry etch equipment.
  • Collaborated with Field Service Engineers (FSEs) team on chamber matching to ensure production WIP and maintain MTBC RFhr.
  • Troubleshot and resolved issues, working with the Fremont Product Group to improve customer process productivity on 130s/140s etch tools.
  • Conducted process qualification for customer pre-series production as project timelines.
  • Analyzed results using Excel, running experiments to ensure process films met customer specifications.
  • Communicated tool qualification results and system acceptance to customers in clear presentations.

Education

Bachelor of Science - Manufacturing Engineering (Material)

Technical University of Malaysia, Malacca
Melaka
04.2001 -

Skills

Process improvement

Teamwork and collaboration

Problem-solving

Time management

Problem-solving abilities

Multitasking Abilities

Excellent communication

Decision-making

Critical thinking

Timeline

Manufacturing Process Engineer

ASMPT SMT Singapore Pte Ltd
06.2023 - Current

Field Process Engineer

Lam Research Pte Ltd
04.2021 - 03.2023

Field Process Engineer

G and B Semiconductor Pte Ltd
01.2017 - 04.2021

Bachelor of Science - Manufacturing Engineering (Material)

Technical University of Malaysia, Malacca
04.2001 -
Tee Kok ChenProcess Manufacturing Engineer (PR Singapore)