Summary
Overview
Work History
Education
Skills
Miscellaneous
References
Personal Information
Timeline
Generic
SHARON FEBLYNA WINONA JANANG

SHARON FEBLYNA WINONA JANANG

Sarikei, Sarawak,13

Summary

  • Test Engineer at Intel Technology Sdn. Bhd. (Kulim, Malaysia) Mac 2024 - Now Responsibilities
  • Execute the Test Program deployment which include setup, validation, and release to ATM in accordance with BU's requirements.
  • Prepare and establish factory systems based on technology, process, and product certification/qualification milestones.
  • Execute with factory engineer teams to support Technology Certification (Silicon Process, Package Technology, and Assembly Test Certification) and product ramp in High Volume Manufacturing (HVM).
  • Execute BU's product roadmap and build plan requirement proactively, initiates and owns the continuous improvement of testing process for key performance indicators (e.g. Safety, quality, cost, yield and retest rate) and work with ATTD and BU as required.
  • Execute the collaborate with STTD and BU, support variety of New developments in ATM (e.g. New test capability from HDMT/BI/OLx/PPV, Automation, AI/Big data, etc.)
  • Address Manufacturability and Productivity issues and drive for solutions.
  • Qualified Test Engineer proven to implement and maintain cost-effective methods of system testing and troubleshooting to reduce operating costs. Technically-savvy and skilled at quickly learning New concepts, software and equipment. Collaborative team player with excellent communication and interpersonal talents.

Overview

2025
2025
years of professional experience
10
10
years of post-secondary education
3
3
Languages

Work History

Test Engineer

Intel Technology Sdn. Bhd.
Kulim, Kedah
3 2024 - Current
  • Execute the Test Program deployment which include setup, validation, and release to ATM in accordance with BU's requirements
  • Prepare and establish factory systems based on technology, process, and product certification/qualification milestones
  • Execute with factory engineer teams to support Technology Certification (Silicon Process, Package Technology, and Assembly Test Certification) and product ramp in High Volume Manufacturing (HVM)
  • Execute BU's product roadmap and build plan requirement proactively, initiates and owns the continuous improvement of testing process for key performance indicators (e.g
  • Safety, quality, cost, yield and retest rate) and work with ATTD and BU as required
  • Execute the collaborate with STTD and BU, support variety of new developments in ATM (e.g
  • New test capability from HDMT/BI/OLx/PPV, Automation, AI/Big data, etc.)
  • Address Manufacturability and Productivity issues and drive for solutions
  • Department: Test Module Engineering

Product Engineer

Intel Technology Sdn. Bhd.
Kulim, Kedah
01.2018 - 03.2024
  • Implement test features for the product from beginning to the backend
  • Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities
  • Department: Intel Manufacturing & Product Engineering (MPE VPE-Volume Product Engineer)

Graduate Intern Technical

Intel Technology Sdn. Bhd.
Kulim, Kedah
06.2017 - 01.2018
  • Helping Engineer to Implement test features for the product from beginning to the backend
  • Department: Intel Malaysia Design Centre (MVE HVE)

Leasing Executive

Scenic Proma Sdn. Bhd.
Bukit Mertajam, Penang
03.2017 - 06.2017
  • Market and lease space in Mydin

Trainee

SIRIM QAS International Sdn. Bhd.
Kuching, 13
01.2016 - 03.2016
  • Doing electrical testing for electrical appliances in the laboratory
  • Department: Electrical & Electronic Testing Laboratory

Education

Bachelor of Science - Applied Science, Science Physics

Universiti Teknologi Mara (UiTM)
Perlis
04.2014 - 01.2017

High School Diploma -

Universiti Teknologi Mara (UiTM)
Penang
04.2009 - 01.2013

Sijil Pelajaran Malaysia(SPM) -

SMK Bandar Sarikei
Sarikei, Sarawak, Malaysia
01.2004 - 01.2008

Skills

SQL, JMP

Microsoft Word, Excel, PowerPoint, Publisher

HVM (High Volume Manufacturing)

Logical & Analytical skills, Problem solving

Second level debug, Shmoo

Miscellaneous

Yes, 2 months notice, RM7000, Yes

References

  • Md Yusof, Anuar B, Manager Test Engineer, Intel Technology Sdn. Bhd., +60 (4) 253 0548
  • Tan, Kuang Hua, Manager Product Engineer, Intel Technology Sdn. Bhd., +60 (4) 433 1143
  • Norlin Shuhaime, Pengurus Akademik, University Teknologi Mara Perlis (UiTM), 019-6417614
  • Muhammad Isam bin Hasan, Senior Technician, SIRIM QAS International Sdn. Bhd., 0198904426

Personal Information

  • IC Number: 910203-13-5726
  • Age: 33
  • Ethnicity: Bidayuh
  • Date of Birth: 02/03/91
  • Gender: Female
  • Nationality: Malaysian
  • Driving License: D
  • Marital Status: Married

Timeline

Product Engineer

Intel Technology Sdn. Bhd.
01.2018 - 03.2024

Graduate Intern Technical

Intel Technology Sdn. Bhd.
06.2017 - 01.2018

Leasing Executive

Scenic Proma Sdn. Bhd.
03.2017 - 06.2017

Trainee

SIRIM QAS International Sdn. Bhd.
01.2016 - 03.2016

Bachelor of Science - Applied Science, Science Physics

Universiti Teknologi Mara (UiTM)
04.2014 - 01.2017

High School Diploma -

Universiti Teknologi Mara (UiTM)
04.2009 - 01.2013

Sijil Pelajaran Malaysia(SPM) -

SMK Bandar Sarikei
01.2004 - 01.2008

Test Engineer

Intel Technology Sdn. Bhd.
3 2024 - Current
SHARON FEBLYNA WINONA JANANG