Sharizad Osman Zahid

Expertise:

• Delivers expert-level work independently, implementing and monitoring specialized processes.
• Applies advanced knowledge and technical skills to analyze data trends and improve operations.
• Demonstrates domain mastery, advising staff and resolving complex challenges.

Leadership:

• Self-directed, independently determining methods for complex tasks.
• Exercises significant autonomy and judgement, providing customized solutions.
• Leads teams, acts as a technical advisor, and guides complex matters to completion.

Decision Making & Impact:

• Makes decisions on non-routine issues, setting daily priorities for teams.
• Responsible for decisions that could result in significant financial impact.
• Collaborates with senior professionals to define work processes and mentor junior staff.

Complexity:

• Manages highly complex and non-standard assignments.
• Leads impactful projects, interpreting and addressing systemic challenges.
• Recommends new processes and improvements to management.

Innovation & Problem Solving:

• Utilizes judgment and creativity to solve highly complex problems.
• Advises management on resolving technical issues with operational insight.
• Regularly provides innovative solutions to the most complex technical challenges.

• As pioneer to transfers first 300mm wafers in Malaysia and responsible for manufacturing processes in Intel’s 3-D Advanced Packaging since its important role in Intel’s IDM 2.0 strategy.
• Certified Applied Material (AMAT) Endura 2 Mainframe Toolset.
• Demonstrate Preventive Maintenance and troubleshoot within the process flow standard & Spec.
• Participated in continuous improvement initiatives, sharing insights and suggestions for enhancing operational efficiency.
• Collaborated with engineering teams to identify areas for process improvement and develop innovative solutions.

I prefer or expert on debugging, repair board (PCB) and also ICT tester (HP3070 & Keysight) as Technician III.
Prefer for server technology especially Arista System product.

• Trace and check the failure of PCBA (motherboard-Arista) by using multimeter, asset test and power supply.
• Troubleshoot and isolate board until pass using HP3070 & Keysight (IN-CIRCUIT TESTER)
• Verify the type of failure by using FABMASTER (Circuit Diagram) and fixed the problem.
• Able to use the soldering method and multimeter.
• Troubleshoot wiring problem and solve the problem.
• Able to use oscilloscope, asset test and power supply.
  
  Knowledge and Skills.
• Have a good communication within among my peers and work as a team to solve the problem.
• Able to work independently.

Provide training and guideline for those newly join technician and willing to share experience with the team. Communicate with Process and Manufacturing side if have any issue related and take full accountability in solving the issue.

• In charged on Thermal Department related to Atmosphere Pressure chemical vapor
  Deposition (WJ 996), EG furnace (Thermco TMX 10000) and Rapid Thermal Process (Steag AST3000), A412 Argon Anneal.
• As a maintenance technician we have to perform line troubleshooting to maintain machine for running the production.
• I also able to troubleshoot machine, replace Generator, replace chiller, replace & install new part, part evaluation and part verification.
• I able to perform calibration like sensor calibration, MFC and etc.
• Company send for training A412 Argon Anneal at Pheonix, Arizona.
  
  

I prefer or expert on debugging, repair board (PCB) and also ICT tester (HP3070) as Senior Technician.
Prefer for server technology especially Cisco System product.

• Trace and check the failure of PCBA (motherboard-CISCO) by using multimeter, asset test and power supply.
• Troubleshoot and isolate board until pass using HP3070 (IN-CIRCUIT TESTER)
• Verify the type of failure by using FABMASTER (Circuit Diagram) and fixed the problem.
• Able to use the soldering method and multimeter.
• Troubleshoot wiring problem and solve the problem.
• Able to use oscilloscope, asset test and power supply.