Rudy Lee

Focused Ops Project Manager adept at planning, directing and maintaining continuous operations in various departments. Experienced in directing manufacturing employees and keeping efficient production in accordance with quality standards. Applying creative and analytical approach to operations for continuous process improvement. Skilled at identifying or anticipating problems and providing solutions. Excels through mentoring, training and empowering team to excel in performance. Leading new product introduction (NPI) cross-functional teams through the Product Development Process (PDP) in support of new product development and transition into full production. This includes developing program goals that supports the business and functional objectives by formulating strategies and execution plan to meet those goals. Responsibilities include setting and fulfilling definitive requirements, priorities, and deliverables by interfacing with internal resources (Test Development, Process Engineering, Equipment, Materials and Operations) and geographically dispersed Product Development sites.

Ops Project Manager III - Jabil

• Successfully transferred of Phase I 32 models from sister-site (Jabil Huang Pu) to Jabil Penang within 3 months from July to September 2020

• Successfully transferred of Phase II 40 models from sister-site (Jabil Huang Pu) to Jabil Penang within 3 months from May to July 2021

• Successfully implement Jabil Advanced Quality Planning tools to monitor project compliance within each phases of the project by models from PCBA level to HLA level with regards to Manufacturing Awards, Product Planning, Engineering Evaluation, Product validation and Start of Production prior project kick start

• Work with Industrial Engineering, EHS and Facilities to establish facilities setup readiness, floor space allocation and expansion for additional hook-up and installation of test equipment, conformal coating machine, oven, chamber and approve chemicals to be used in the plant

• Work with Test, Logistics and Facilities team to facilitate the transfer of tooling via land freight from sister-site (China) to Jabil Penang plant, which spanned across from China, Laos, Vietnam, Cambodia, Thailand and Penang is to ease the lead time from 14 days to 8 days in which previously deployed by sea route

• Work with Customer, Business Unit, Procurement, Supply Chain to facilitate the materials transfer from sister-site (Jabil Huang Pu) to Jabil Penang within 10 days

• Steer and co-ordinate with Workcell and production team to expedite the manufacturing processes from SMT until shipping to ensure meeting customer on-time delivery within 14 days

• Successfully get customer agree to procure materials from open market due to non-availability from approved supplier

• Successfully localize packaging materials to local supplier instead of depending on overseas supplier to eliminate the lead time from 14 days to 10 days

• Successfully established materials inventories system to prevent unexpected materials shortages by introducing “Min” and “Max” level particularly for long lead time materials

• Successfully performed and identified DFM issues to customer pertaining to PCB layout flaws on the “Hot-Items” to improve before kick-off mass production

• Live video call with sister-site Team and customer to provide technical expertise in terms of training needs analysis for tester setup, installation and verification with known good sample prior qualification build kick start

• Successfully applied Fishbone chart to indicate the cause and effect of the header and receptacle connector in which recommend to customer to replace with key-in plug type instead of threaded plug type

• Successfully achieved Phase I qualification build of 32 models kick-off on October 2020 successfully shipped and delivered by mid of December 2020

• Successfully achieved mass production of 20 models officially kick-off on mid of January 2021 and shipped by March 2021

• Successfully achieved mass production of 15 models officially kick-off on April 2021 and shipped by mid of May 2021

• Successfully achieved Phase II qualification build of 40 models kick-off on August 2021 successfully shipped and delivered by mid of October 2021

• Successfully achieved mass production of 10 models officially kick-off on December 2021 and shipped by January 2022

• Work cohesively with Keysight Penang and US Team and external supplier to expedite part changes qualification of the approval changes made on the mechanical drawings and materials readiness delivery

• Advised to Keysight Penang and US Team with regards to the EMI gasket rework risk assessment due to potential copper gasket will drop off during the removal process internally of the chassis if miss out, potential risk of electrical shock

• Successfully support from Keysight US Test Team to release test software of the 5 units to overcome fan speed issue due to incompatible version from previous batch

• Successfully overcome changes made on the modification of metal enclosure of Keysight NAS, and shipped pilot build unit of 5 sets to meet urgent delivery

• Successfully drive for ECN release of new parts pertaining to new parts cut in from 5 days to 2 days to meet customer urgent shipment

• Successfully completed 14 units of RMA remodeling units from Keysight NAS to lower cost version, in which 4 units consists of Direct Order Fulfilment (DOF) shipped direct to customer

• Established project schedule and share to customer on the lead time of the materials prior to commit schedule delivery

• Live video call with Advantest Team to provide technical expertise in terms of training needs analysis for tester test head wiring upgrade

• Work with Industrial Engineering team to expedite the replacement of tester test head POGO block wiring from previous AWG22 to AWG18 with total of 10 sets for Advantest Verigy 93000 EXA Scale SOC Test System

• Successfully shipped 2 units pilot build of SOC Test System Ringo mainboard to Advantest US

• Steer and execute Advanced Quality Planning tools for all project execution with 2 weeks timeline prior phase gate review kick-off with respective stakeholders

• Successfully drive and execute product validation phase within 3 weeks prior meeting Workcell quality objective of FPY 97.00% before moving to SOP phase

• Successfully drive and closed SOP phase of 5 models out of 25 models to fully release to manufacturing

• Successfully reduce aging WIP’s from 140 units to 10 units consists of 3 customers

Manufacturing Section Head - IQ Group Holdings Berhad

• Implemented Just-in-Time (JIT) production methodology to control costs and inventory, resulting in a 20% improvement in efficiency

• Replaced labour-intense processes while simultaneously enhancing workflow through new technology that reduced staff by 15

• DFM to re-design multi cavities PCB slot width from 5.0mm to 2.0mm to eliminate solder overflow

• DFM to improve QFP package ambient light sensor PCB foot print width from 0.5mm to 0.7mm to eliminate solder non-wetting issues

• DFM to improve PTH regulator solder bridging to enlarge PCB foot print length from 2.0mm to 5.0mm, to enable solder dragging effect and prevent excess solder during wave soldering process

• DFM feasibility study to use “Bow & Twist“ with thickness measurement filler method to measure PCB warpage > 7mils / inch spec, and propose to R&D to re-design PCB layout by adding extra PCB edge to strengthen and prevent PCB warping issue during wave soldering process

• Propose to R&D group on SMD component orientation placement to follow IPC-610 standard to eliminate solder non-wetting issues

• Propose to Engineering group to add silicone standoff against the PTH IR lead to prevent bending caused by optical lens after enclosure

• Propose to Engineering group on PIR sensor seat to revise the existing stud diameter from 0.5mm to 0.4mm (±0.01mm) to compensate the PIR sensor seat stud insertion issue against the PCB, trigger SQE to perform upfront sample inspection on supplier site to prevent issue reoccurrence

• DFM feasibility studies to propose and improve existing PCB reliability material (Phenolics) to FR4 double sided 4 layers material for optimum product quality

• DFM to improve power supply module multicore lead wire of AWG25 (0.455mm) protruded 4.0mm cause solder cracked, thus increased the lead wire protruded to 4.5mm when wave soldering process against the PCB PTH sufficient lead wire to form solder bell curve

• Failure analysis on metal core PCB LED due to no light up issues during power up test, after investigation found mechanical overstress during de-panelize process, improvement on de-panelize equipment by adding linear slider underneath the support jig to prevent metal core PCB bending leads to mechanical overstress

• Improve to add stiffeners on solder wave solder pallet to support the wire harness from bending cause insufficient solder against the PCB

• Apply pin chart with PCBA assembly drawing to initiate immediate action against quality issues related to process, design and workmanship to serve as a quality alert for improvement

• Connect transient voltage suppressor (TVS) in the functional tester against the output voltage with respect to the test probe to arrest sudden high voltage against the DUT

• ROI on benchmarking various selective wave soldering machines vs existing and new product in associated with product and machines capability and process improvements

• Formulate and implement PCBA repair procedure and chart to assist Repair Technician establish proper method on PCBA troubleshooting with the use of right soldering and de-soldering tools with respect to the components

• Identify training needs analysis (TNA) for existing Repair Technician, new hires, and interns to perform practical training with the use of obsolete or scrap PCB

• Execute weekly MRB meeting with the respective department Team members to advise the corrective action of PCBA disposition. (hardcore PCBA, beyond repair, incoming defective (material), workmanship, process)

• Successfully coordinate product transfer and manufacturing support built (350pcs PCBA, 350 complete unit) on Aug 2016 to Nov 2016

• PTH barrel fill improvements by pre-heat the PCB 100°C at 60sec to eliminate thermal lag, and perform X-ray inspection to observe PTH barrel > 75% filled per IPC standard 610

• Improvements on PCB stencil aperture dimension opening design for existing PCB re-layout to eliminate solderability issues

• Metal core PCB de-panelize equipment top and bottom blade cost reduction from RM3,400 to RM2,280 quarterly

• DFM feasibility studies to improve PCB layout by removing jumper connection to replace by copper track (cost improvement: RM15,000)

• DFM solder bridging improvements to revise PCB layout based on IPC610 standard (cost improvement: RM10,785 quarterly)

• Reduced staff by 20 while maintaining production levels through a redesign of operational processes and improved training and staff utilization

• Play integral role in identifying and transitioning work to outsourced vendor, reducing total manufacturing costs by 30%

• Replace PTH components manual soldering to automated robotic PTH components soldering process with customized fixture supported (cost improvement: RM35,380 quarterly)

• Implement wave soldering palletize to reduce conveyor changeover cycle time by standardize the wave soldering pallet dimension (cycle time improvement: - setup time: 20 mins (before palletize), setup time: 0 mins (after palletize)

• Implement semi-automated feed robotic soldering machine to eliminate labour intensive dependency on manual soldering process of plating through hole components with respect to the PCB

• Observe PCB substrate delamination caused bubbling issues during wave soldering process, failure analysis on cross-section determine moisture trapped within PCB internal layer, proposed PCB pre-heat at 100°C at 60sec prior wave soldering process, excess PCB to vacuum pack to prevent further moisture trap

• Improve manual heatsink thermal paste application jig to cost effective pneumatic universal base with customized stencil thermal paste application jig

• Implement Hi-Pot test with 1.8KV at 0.8msec probing on the metal casing of High Bay and Mid Bay Lamp to ensure no current leakage

• Define and implement snubber circuits to serve as a protection circuit in the power supply module occurs due to switching operation, lightning strikes, short circuits

• Implementation of manufacturing activities include continuous process improvements via KANBAN and KAIZEN process using PDCA tools

• Drive and manage overall PCBA repair WIP to 5% target weekly

• Reduced non-recurring engineering (NRE) cost by 40% to eliminate non-value added services on the manufacturing activities

• Reduced RFQ processing lead time from 4 days to 2 days resulting in USD450k in cost savings per year

• Successfully handled various capacity expansion, cost reduction activities and quality improvements project from counterparts in Taiwan, China, US, Europe and Japan

Test Design Engineer II - Plexus Corp, Electronics Manufacturing Services (EMS)

• Development of functional tester to test the PCBA level of a patient monitor module using NI LABView test platform to execute the test sequence

• Development of St. Jude Medical devices HLA Tanto Hi-Pot tester using Plexus Test Executive to execute the test plan

• Improvement on X-Ray Universal RAD mainboard by adding a fly-back diode to the device as protection from high inrush current flow back

• Implement the self-test platform to identify the hardware malfunction for the aerospace electronic devices

• Improvement in terms of testability of the functional tester with respect to hardware and software to identify and eliminate the intermittent issues and flaws

• Re-designed relay switching cards by adding fly-back zener diode in parallel with the relay output to prevent high inrush current storage in the relay flow back to the system circuitry after power off which causes malfunction to the system circuitry

• Manage ECO change for software release application package, control matrix, BOM

• Improvement on Bluetooth test device to eliminate the intermittent failure by implementing RF Shield-box

• Improvement on the functional tester failed to power on the device during boot-up on respective test cavities to add grounding wires

Senior Test Development Engineer II - Kontron Asia Pacific Design Sdn. Bhd.

• Develop mechanical functional fixtures and jigs to support manufacturing test on networking protocol for IP KVM switches on OEM branded (Avocent, IBM, HP, Dell, Fujitsu-Siemens)

• Hardware development for device firmware via TFTP and RS232 programming

• Analyzing device hardware and software architecture to develop test specific requirements for testing

• Designed and implemented interface hardware for PXI test platform.

• Maintain device that have been previously released to manufacturing for testing, these often includes test code debugging, test hardware interaction

• Integrate test solution for optimum test coverage and automation.

• Improvements on manufacturing test time by splitting the existing test station to the next station to eliminate bottleneck test time

• Execute test development activities on various platform (Electronics, Electrical, Mechanical and Electro-Mechanical) and implement pneumatic mechanical test jigs and fixtures design to ease test manufacturing processes improvement

• Hands on customized tester for overall interface parts assembly, installation and manufacturing test setup

• Successfully developed, installed and setup of Qualcomm PCBA level test and HLA level test with total of 34 units of tester in Production ramp up

Test Manufacturing Engineer I - Siemens VDO Automotive AG

• Maintain automotive tester and equipment to ensure test specification are within the limits and compliance with TS16949 automotive standard

• Develop tester maintenance procedure for maintenance support Technician to carry out tester maintenance guidelines, and training purposes

• Improve product test coverage for through hole components from In-Circuit test system by adding test jet on top of the components to detect either open or short test

• To perform system self-test on test equipment with known good sample to validate the individual section and sub-section test system hardware failure which contribute either from test equipment or device under test (DUT)

• Identify designated test probes are being deployed against the DUT to prevent false reject by weekly audit each test jig, and immediate action replace the required test probes

Test Engineering Technician II - Unico Technology Berhad

• Undergone industrial training at Intel Kulim Motherboard Design Center of Malaysia (BDCM), and gained beneficial experience to learn about the actual board design concept, circuit analysis, engineering change and identify fault locating techniques

• System configuration and supporting circuits with the development of new ICs which were to be used in the latest motherboard system

• Evaluation and troubleshooting of IC's prototype circuits, and series of performance and reliability specifications (radiated and conducted emissions, RF immunity, EFT/B and surge immunity, voltage dips/interruptions, high and low temperature tests, temperature cycle test, aging test, etc)

• Provide key training to manufacturing Repair Operator to upscale their repairing skills, with the use of right tools and IPC standard 7711/21 methodologies to perform repair on the rejected main board

• Develop PCBA WIP tracking matrix based on product models to ease repairing activities with pivot table

• Introduce the product directly to a sub-contractor manufacturing facilities and supporting the initial production process in order to ramp up the yield

• Hands on experience in repairing and debugging complex PCBA down to SMD component level of soldering from 0201 to 2512 packages and de-soldering of (SMD, BGA, MSOP, QFP, TQFP, PLCC, SSOP, Fine Pitch)

• Hands on test equipment handling (Multimeter, DC Power Supply, DC Electronic Load, Oscilloscopes, Curve Tracer, Logic Probe, RF Shield-box, Spectrum Analyzer, Network Analyzer, Data Logger, Data Acquisition, Signal Generator)

• Certified LEAN Six Sigma, Jabil
• Microsoft Project, OTC Training Center
• ISO9001:2015, SGS Academy
• ISO14001:2015, SGS Academy
• Compliance & Management Risk, MYWAVE
• Six Sigma & DFSS, Neville Clarke
• LabVIEW Development, National Instruments
• Social Responsibility System SA8000, Total Performance Advance Consultancy