Phei Chen Wong

Logistic Operation Manager with 3 years in a leading multinational company of Fortune 500.

-Expertise in building high performing teams and high velocity organizations to manage Intel logistic biz needs.

-Experienced leader in managing organizations in all aspects from logistic engineering / transportation digitization / transformation efforts to supply chain advancement initiatives.

-Experience contracting and managing transportation suppliers, to leverage their expertise while maximizing the value add of the organization.

-Demonstrated abilities to lead global cross functional groups from multiple countries and functions to delivery innovation and transformational strategies.

-Heavily engaged in developing new system to improvised tactical operation support namely building E2Open Control Tower logic / Logistic TMS transportation management system / Power BI ship tracking mechanism / NCRM new contract rate management & Alteryx import and export custom report to minimize manual intervention and instill high data accuracy.

Overseeing >10 Intel Global Test Suppliers by driving value across Ariba

procurement contracts and supplier relationships including commercial contract compliance and driving technical performance.

-Accountable on Intel Test Equipment & Tooling Collaterals suppliers’ supply chain management across Asia. Sound experience in qualifying pricing & lead time in procurement contract through should-cost framework & benchmarking.

-Engineered High Density Modular Testing system along with Burn In Structure to assimilate Intel product performance in the motherboard / Develop Breaking Mechanism solution for tester thermal head recovery with Singapore thermal expert / Design multiple Handler Kit to transport units precisely in test enclosure for actuation test / Evaluate Intel Test Interface Board performance to address unit performance for subsequent failure debugging.

Manage Intel Merger and Acquisition (M&A) Business Supply Chain Network Setup:

Ex: Led Infineon / Avago / Fulcrum / Mindspeed / Infiniband – Q Logic Biz Setup enabling total Supply Chain Network across Global Subcon / RnD / MIW Warehouse / Intel Customer in terms of Warehouse Operations / Customer Order Fulfillment / IT Readiness / Planning / Transportation / Packaging / Facilities / Resource Mapping etc.

Project Management, Packing: Transport Media NPI Design / Development & Sustaining support for Component / System Manufacturing Product for ATM, Subcons & 3rd Party Logistic. Ex: Led “DN Consolidation for Palletization” program across Australia, Korea, Japan, Taiwan & Vietnam. To support emerging market, Phei Chen enabled multiple NPI Packaging & Transport Media collaterals to facilitate product flow across Intel fab / assembly / test / warehouse & subcon to support ND / CCD / ECG / NDG / MCG & UMG key market segment.

Defines Packing Requirement/Specification including Lab Methodology to support testing of multiple product certification from wafer to die level to assembled package all the way to tested finished goods and Intel retail products that meets product startup schedule, logistics & cost / quality requirement aligning to both Intel Bluebook standard & ISTA industrial spec while calling out most appropriate transportation mode used on shipment.

Pioneer for Testing several new Intel Enabled Technology from Internet of Things Group such as Real Sense Camera by applying smart feature in warehouse and forwarder operation in order to greatly minimize the inaccuracy of dimensional weight reporting system in freight charging that easily costs over millions if accuracy.

Green Laser Mark / ICOS / Bake & FVI Senior Process / Equipment Developer & Engineer

-Orchestrated the research of identifying ideal Green Laser Spectrum and depth measuring methodology for solder resist marking application / defining robust process control system (PCS) requirements to ensure process sustainability & develop ASTRA LMA station controller to consistently monitor process quality consistency.

-Led the qualification of assembly units solderability testing before and after baking process to determine the right success criteria for Intel product final acceptance.

MHS / Media Senior Process and Equipment Engineer

-Pioneer in leading and designing material handling system conveyor technology for supporting Intel first flip chip molded array platform with Japan and US key technology expert. Well verse in creating multiple conveyor concept in supporting all module through entire complex pipeline.

-Expert in designing process and shipping media along with testing methodologies to transport and protect Intel products during shipment.