Peng Peng Wong

• Developed emergency preparedness plans to minimize damage from events such as fires or floods.
• Conducted regular walk-throughs to identify potential issues before they became critical problems needing costly repairs.
• Prioritized accessibility enhancements in common areas to ensure inclusivity for all employees and workers or mobility challenges .
• Streamlined work order processes for better tracking, prioritization, and completion of tasks.
• Improved building efficiency by implementing preventive maintenance programs and energy-saving initiatives.
• Coordinated large-scale renovation projects while minimizing disruption to tenants'' daily activities.
• Maintained accurate records of all maintenance activities, permits, warranties, and inspections for easy reference and reporting purposes.
• Reduced operational costs by negotiating contracts with vendors for services such as cleaning, landscaping, and building maintenance
• Managed a team of technicians and suppliers (cleaner and maintenance team - outsources) , ensuring their consistent training, development, and adherence to safety protocols.
• Enhanced tenant satisfaction through timely response to maintenance requests and addressing issues proactively.
• Collaborated with property management on budgeting and forecasting for building maintenance expenses.
• Successfully managed multiple facilities simultaneously while maintaining high levels of service across locations .
• Optimized space usage (office cubicle, production floor tool install) within the facility through strategic planning and efficient allocation of resources.
• Documented inventory of spare parts to enable tracking history and maintain accurate records.
• Collaborated with other departments to verify completion of maintenance tasks.
• Monitored priorities and liaised between maintenance team and management, delegating tasks to complete on time.
• Completed partial or full dismantling of equipment to quickly repair or replace defective components and restore functionality.
• Set aggressive targets for building maintainance project to drive company success and strengthen motivation.
• Manage cafe provider to meet on food variety, food safety, kitchen equipment and facility maintenance.

• Managed the operation and upkeep of **NQFN/QFN End-Of-Line (EOL) packaging equipment, ensuring efficient production flow for Trim & Form, Singulation, and Laser Marking processes.
  Gained hands-on expertise with diverse EOL equipment & tooling including:
  Singulation: Hyde Saws (Hanmi), Package Saws (Disco DFD series/Rokko, Accretech Rokko).
  Laser Marking: EO Tech Lasers.
  Trim & Form: ASM Mphenix
  Executed daily tasks: equipment setup, process monitoring, recipe verification, troubleshooting tool errors, performing preventive maintenance (PMs), and basic corrective actions.
  Ensured product quality and metrology requirements were consistently met for processed units.
• Reduced downtime with proactive identification and resolution of equipment issues before they escalated.
• Boosted team efficiency, trained technicians and engineers on latest equipment handling techniques and safety protocols.
• Established preventive maintenance schedules to minimize breakdowns and extend the life of equipment.
• Reduced downtime in operations by performing proactive maintenance on equipment.
• Optimized equipment allocation , ensuring right tools were available at right time for maximum productivity.
• Tooling and equipment setup stability by package

• Led the strategic operation, maintenance, and performance optimization of a critical semiconductor die bond equipment portfolio supporting high-volume manufacturing.
  Managed and developed a team of (40 technicians and 3 engineers) fostering technical excellence, safety compliance, and accountability across 3-shift operations.
• Directed the full equipment lifecycle for advanced die bond platforms (installation, Qualification, Ramp, Sustaining), including:
  - ASM: ASM838, ASM8312, ASM8312P, ASM Infinite series
  - Canon: Canon D01
  - ESEC: ESEC 2008 and ESEC 2007
• Drove continuous improvement initiatives, reducing unscheduled downtime by below 6% and increasing overall Equipment Effectiveness (OEE) by through enhanced PM strategies, rapid troubleshooting protocols, and technician cross-training programs.
• Spearheaded complex troubleshooting and root cause analysis for bond quality issues (e.g., non-stick, die shift, bleed-out), improving line yield and reducing scrap costs
• Ensured strict adherence** to industry standards (ISO 9001/IATF 16949), ESD protocols, cleanroom requirements, and safety regulations, achieving [Result: zero safety incidents, successful audits].
• Collaborated closely with Process Engineering, Production Planning, and Quality Assurance to ensure seamless line support, new product introductions (NPI), and rapid resolution of cross-functional issues.
• Owned equipment documentation (SOPs, PM specs), calibration schedules, and software management (e.g., recipe control)
• Leveraged deep technical expertise to evaluate new equipment, drive upgrades, and provide technical mentorship to the team.
• Maintained accurate records of equipment usage, enabling better planning and scheduling for future projects.

• Directed wire bonding operations for high-volume production, managing equipment strategy, technician teams, and process performance across 24/7 manufacturing.
• Led and developed** a team of 60 Equipment Technicians and 3 Equipment Engineersdriving technical excellence, safety compliance, and continuous improvement in wire bond operations.
• Mastered advanced wire bond platforms:
  - Kulicke & Soffa: NuTek, Maxum Plus, Connx Plus, Connx Elite ELA
  - ASM: Twin Eagle (dual-head)
• Boosted equipment efficiency by reducing unscheduled downtime through predictive maintenance programs and rapid troubleshooting protocols.
• Improved key metrics:** Achieved OEE gain and yield uplift via bond parameter optimization, capillary management, and AI-driven process control (e.g., K&S Adaptive Bonding).
• Drove compliance with ISO 9001/IATF 16949, achieving zero major audit findings
• Pioneered cross-training programs enabling team certification on both K&S and ASM platforms.

• Engineered and optimized wire bonding processes for high-volume semiconductor production on advanced K&S and ASM platforms.
  Expertise in critical wire bond systems:
  - Kulicke & Soffa: NuTek, Maxum Plus, Connx Plus, **Connx Elite ELA** (AI adaptive bonding)
  - ASM: Twin Eagle** (dual-head configuration)
• Achieved equipment uptime on Connx Elite ELA machines through predictive maintenance scheduling and real-time parameter monitoring.
• Boosted yield on NQFN/QFN devices by resolving stitch lift issues via parameter optimization and capillary selection studies with process engineer.
• Reduced gold wire consumption through loop height optimization and K&S Adaptive Bonding implementation. and Pioneer of the company on Cu Wire Qualification & implementation
• Developed PM kits and work with process on extending capillary life with increase touch down, reducing consumable costs
• Cost Engineering Impact - Wire type use, Loop Height Control, Capillary Life (Touch down), Capillary design study on optimization, reduce Scrap Rate (Process Control)
• Advanced Platform Mastery and implementation
  - Connx Elite ELA (AI bonding, multi-loop)

- Twin Eagle dual-head synchronization
- NuTek high-precision fine-pitch bonding

• Engineered and optimized wire bonding processes for high-volume semiconductor production on advanced K&S and ASM platforms. Expertise in critical wire bond systems: - Kulicke & Soffa: NuTek, Maxum Plus, Connx Plus, **Connx Elite ELA** (AI adaptive bonding) - ASM: Twin Eagle** (dual-head configuration)
• Achieved equipment uptime on Connx Elite ELA machines through predictive maintenance scheduling and real-time parameter monitoring.
• Boosted yield on NQFN/QFN devices by resolving stitch lift issues via parameter optimization and capillary selection studies with process engineer.
• Reduced gold wire consumption through loop height optimization and K&S Adaptive Bonding implementation. and Pioneer of the company on Cu Wire Qualification & implementation
• Developed PM kits and work with process on extending capillary life with increase touch down, reducing consumable costs
• Cost Engineering Impact - Wire type use, Loop Height Control, Capillary Life (Touch down), Capillary design study on optimization, reduce Scrap Rate (Process Control)
• Advanced Platform Mastery and implementation - Connx Elite ELA (AI bonding, multi-loop)

- Twin Eagle dual-head synchronization - NuTek high-precision fine-pitch bonding

• Circuit Design: Power amplifiers, preamps, DSP interfaces, power supplies (SMPS), crossovers, protection circuits
• PCB Design: Altium Designer/Cadence (Schematic Capture, Multi-layer Layout)
• Validation & Testing: Audio precision, environmental and reliability
• Troubleshooting: Component-level root cause analysis (RCA), oscilloscope/logic analyzer, thermal imaging
• Increased product reliability, conducting rigorous stress tests on prototypes during the development process.
• Improved hardware design efficiency by implementing advanced simulation and testing techniques.