Microsoft Office
Norfarahniza Mohamed Yusoff
Analog Product Development Engineer
Penang
Summary
Dynamic professional with a robust background at Intel for almost 7 years. Excelled in cross-departmental collaboration, enhancing system reliability through meticulous data analysis and product specification. Demonstrated exceptional verbal communication and teamwork, driving detailed and organized solutions to establish product quality and efficiency.
Overview
6
6
years of professional experience
Work History
Digital Thermal Sensor & Power Thermal
Intel
05.2024 - Current
- Collaborated with interdisciplinary teams to maintain and enhance thermal setting to run volume units
- Updated and understanding the thermal profiling to prevent any upcoming issue across all subflows and multiple temperature setup
- Performed characterization for power and thermals, including thermal profiling and recipe tuning for production thermal control
- Evaluated tailored trimming and calibration for power delivery for the product run
- Evaluated and understanding the thermal sensing circuits to each individual die and provide building blocks for power and performance binning and improvement
- Upheld high standards of professionalism under pressure serving teammate across department to coordinate a gating issue
- Updated sensor data analysis regularly, improving overall system efficacy and reliability
High Speed IO
Intel
07.2019 - 04.2024
- Worked with designer and product teams to drive design for test, debug and validation to meet standard of internal and industry specification
- Reviewed test plans with design, conversion of pre-silicon content to patterns to meet the test specification
- Performed automatic test equipment (ATE)-to- design validation (DV) correlation, debug functionality and performance issues
- Evaluated new IP's design on ATE to circuit and bench characterization in parallel with meeting the spec validation
- Built data analysis and utilized the data sheet specification while performing margin-to-spec analysis in meeting product yield and product health indicator (PHI)
- Engaged with manufacturing to monitor and optimize production yield and resolves any post-release concern before release to customer
Graduate Engineer Trainee
Intel
09.2018 - 06.2019
- Validate structural test content and hands-on in manufacturing environment using testing equipment, analyze products' performance and perform first level debug when issue detected
- Developed test content and validate the modules in early product development phase
- Conducted data analysis and debug documentation to ensure the best solving method is implemented
Education
Master of Engineering - Electrical And Electronics Engineering
Brunel University London
London 04.2001 -
Bachelor of Engineering - Electrical And Electronics
Brunel University London
London 04.2001 -
Skills
Verbal and written communication
Quality control
Root-cause analysis
Data analysis with tools and AI
Teamwork and collaboration
Self motivation
Time management abilities
Accomplishments
- Achieved One Intel, Result Driven & Quality Award
- Resolved product issue through consumer testing and fast debug implementation
- Collaborated with team in JF US and BA in the development of products
- Used Microsoft Excel to develop tracking spreadsheets across the product timeline
Software
JMP
Git Bash
Timeline
Digital Thermal Sensor & Power Thermal
Intel
05.2024 - Current
High Speed IO
Intel
07.2019 - 04.2024
Graduate Engineer Trainee
Intel
09.2018 - 06.2019
Master of Engineering - Electrical And Electronics Engineering
Brunel University London
04.2001 -
Bachelor of Engineering - Electrical And Electronics
Brunel University London
04.2001 -
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