MOHD JOHARI ISHAK

Professional Summary
Results-driven Hardware Application Engineer with specialized expertise in automotive-grade cellular and GNSS modules (e.g., WCM529R, AG525R, AF51Y families). Proven track record in failure analysis, quality assurance, and customer technical support, consistently reducing PPM rates, improving component quality, and enhancing product reliability.
Core Competencies

Schematic design review and reference design validation for automotive module projects
Component defect analysis and advanced failure analysis (dye penetration, cross-sectioning, chip grinding, X-RAY, oscilloscope-based diagnostics)
Root cause analysis and corrective action implementation in collaboration with R&D, sourcing, and quality teams
Technical customer support: troubleshooting complex hardware issues, optimizing SMT processes, and improving production yields
Hardware design consulting, application note authoring, design review delivery, and customer training
Continuous tracking of emerging technologies (high-speed interfaces, MCUs, automotive-grade components)

Key Achievements

Significantly reduced production-line and field failure rates through systematic defect investigation and corrective measures
Improved component sourcing quality and overall module reliability for automotive applications
Served as trusted technical consultant to customers, enabling successful module integration and higher first-pass yield

Strong collaborator with cross-functional teams focused on delivering high-reliability hardware solutions in demanding automotive environments.

Job Scope Overview:

• Drone Operation: Proficient in flying DJI Mavic series drones.
• Gimbal & Stabilization: Experienced with gimbal technology and stabilization systems.
• PTZ Knowledge: Familiar with PTZ functionality and error analysis.
• MES Systems: Knowledgeable in MES systems to maintain process integrity.
• Failure Analysis: Skilled at identifying root causes and symptoms of production unit failures.
• Problem-Solving: Excellent problem-solving skills with strong attention to detail.
• Teamwork: Able to work independently or collaboratively as part of a team.

Professional Experience:

• Failure Analysis: Conducted detailed analyses on PCBA, testing, and assembly products using tools like multimeters, oscilloscopes, and X-ray diffraction.
• Investigation Leadership: Led investigations into product failures, identifying root causes and recommending corrective actions to prevent recurrence.
• Cross-Functional Collaboration: Worked with design and manufacturing teams to implement improvements that enhance product reliability.
• Technical Reporting: Developed and maintained comprehensive reports documenting failure analysis findings and recommendations.
• Statistical Support: Used statistical analysis and data interpretation to back failure investigations and validate solutions.
• Customer Engagement: Presented technical reports in meetings with customers.
• Lean Implementation: Applied lean manufacturing principles in the failure analysis lab to improve workflow efficiency.
• Complex Problem Solving: Collaborated with cross-functional teams to identify and resolve complex failure mechanisms in semiconductor devices.

Job Scope Overview:

• Failure Analysis: Investigate customer returns (RMA) and production rejects (FRESH).
• Collaboration: Work with technicians to troubleshoot board failures and improve skills.
• Hands-On Skills: Perform soldering and BGA rework using stencils and rework stations.
• Feedback Loop: Communicate with customers and engineering teams to address recurring issues like solder shorts and defective components.
• Debugging Support: Assist line technicians with debugging and failure analysis, creating detailed reports.
• Comprehensive Reporting: Prepare failure analysis reports, applying ISO 9001, Kaizen, and Kanban methodologies; support 8D reports and suggest countermeasures.
• Equipment Utilization: Use tools like thermal cameras, solder short locators, oscilloscopes, and multimeters for analysis.
• Analytical Skills: Demonstrate strong problem-solving abilities to resolve issues effectively.
• Adaptability: Show a willingness to learn and adapt to new technologies.
• Lean Manufacturing Experience: Supervise technicians and repair teams in a Lean environment.

Professional Experience:

• Troubleshooting Procedures: Prepared work instructions for troubleshooting.
• Training: Trained and assisted technicians in troubleshooting and repairing customer products.
• Production Support: Supported repair technicians in reworking non-hardcore production failures.
• Reporting: Prepared technical reports for RMA and production processes.
• Monitoring: Monitored RMA repair rates and aging times.
• SFC Tracking: Tracked Sequential Flow Control (SFC) aging times.
• Cost Reduction: Contributed to reducing production costs through process improvements.

Job Scope Overview:

• RF Board Alignment & Tuning: Optimize transmit and receive signals for RF boards.
• Testing & Troubleshooting: Diagnose and resolve issues with RF boards and the DME-37B LRU unit.
• Collaboration: Work closely with sustaining engineers for effective troubleshooting and issue resolution.
• Data Management: Collect, analyze, and report data related to RF board performance.
• Target Achievement: Meet weekly shipping targets and daily goals to reduce RF board failures.
• Reporting: Submit daily reports for tracking output and performance metrics.
• Cross-Training Coordination: Facilitate knowledge sharing and skill development within the team.
• SAP Utilization: Leverage the SAP system for job-related tasks.
• Technical Expertise: Develop specialized knowledge in troubleshooting RF boards, particularly the Quantum DME-37B.
• Lab Equipment Proficiency: Utilize tools like signal generators, spectrum analyzers, RF network analyzers, multimeters, frequency counters, and oscilloscopes for alignment and troubleshooting.
• Product Transfer Support: Participate in hands-on manufacturing and technical training in Kansas, USA, focusing on the Quantum DME-37B.

Professional Experience:

• Production Oversight: Ensured timely production delivery with zero discrepancies.
• Downtime Reduction: Minimized major downtime to improve operational efficiency.
• Troubleshooting: Efficiently diagnosed and repaired assigned equipment within set timelines.
• Root Cause Analysis: Conducted analyses of failures to prevent recurrence.
• Record Keeping: Documented all maintenance and failure events in equipment history data sheets.
• Complex Issue Resolution: Assisted in troubleshooting complex production issues, quickly identifying root causes.

Job Scope Overview:

• Troubleshooting: Perform component-level analysis for digital multimeters (ALF-34401) and data acquisition/switch units (34970A) across various measurements (Ohms, DCI, DCV, AC, ACI).
• Inventory Management: Oversee units under repair for efficient workflow and timely resolutions.
• Collaboration: Work with Product Engineers to tackle complex repair issues.
• Tool Utilization: Use multimeters, oscilloscopes, function generators, Fluke calibrators, resistance meters, and VEE software for troubleshooting.
• Defect Resolution: Collaborate with Material and Product Engineers to address part defects.
• Meetings: Organize discussions to collaboratively resolve product issues.
• Reporting: Create weekly reports on top defects to analyze failure trends and maintain daily reports to track ongoing product failures.

Job Scope Overview:

• Diagnostics: Use tools to identify issues in software and hardware systems.
• Problem Investigation: Analyze error logs, run diagnostic tests, and replicate issues to understand them better.
• Issue Resolution: Apply fixes or updates, then test systems to ensure problems are resolved without introducing new ones.
• Documentation: Maintain detailed records of issues, solutions, and testing processes to enhance future troubleshooting.
• Collaboration: Work with engineers and technicians to solve complex problems effectively.
• Continuous Learning: Stay updated on the latest technologies and best practices to address evolving systems and new issues.