Summary
Overview
Work History
Education
Skills
Design and repair
Timeline
Generic
KOK BENG HONG

KOK BENG HONG

Process And Equipment Engineer
Kulim Kedah,02

Summary

Professional in Preventive Maintenance, NPI, Process Control, FMEA, IQ setup, Equipment Development. Have experience in handle the BGA Chipset, Server and Automotive product.

Overview

19
19
years of professional experience
8
8
years of post-secondary education

Work History

Process and Equipment Engineer

Intel Technology
06.2008 - Current
  • Carried out assigned NPI, N+1 product qualification, Pdm, DOE, cost saving and preventive maintenance lead projects and initiated project observation and research to deliver manufacturable solutions.
  • Enhanced protrusion tool design to again substrate warp page issue with pokayoke concept and functionality of existing equipment to meet operational needs from safety, USDT, stability and MORV perception in manufacturing.
  • Interpreted new recipe blueprints, technical drawings, Autocad schematics and computer-generated reports for new product development DSU.
  • Facilitated more than 20 NPI product on Ball Attach, IAM and Deflux process for enhanced production capability to achieve launch of new products including DSU and product transfer from US test development.
  • Travel to US and supplier site for tested newly installed systems and new tool install based on quality characteristics verification experiment, closely monitoring functionality and adherence to operating specifications before tool setup in factory.
  • Generated NPI and product qualification schedules, drawings of material and manuals for engineered equipment using statistical design to deliver quality performance.
  • Able to create and generate new spec and revised specs based on SPC PCS data,FMEA and MCA to define control limit using jmp software thru DOE data collection to evaluated best tool performances.
  • A lead on preventive module team for Ball Attach Module on preventive maintenance and troubleshooting to maximize equipment performance on 5 years experience. Successful Improve USDT, MTBA, MA and AU performance on tool and link improvement.
  • Applied new generation deflux link and tool qualification mechanical problem solving skills to develop creative solutions for CAPA, safety, quality products, USDT, MTBA and output.

Final Test Technician

Flextronic
03.2006 - 06.2008
  • Attended AGILENT ICT training to gain knowledge of program needs for test failure diagnosis and repair.
  • Provided recommendations for improvements in testing procedures in LAN and Motherboard to engineer and Intel supplier.
  • Communicated product failures and testing problems with ICT test and board tester to engineering department.
  • Setup first USDT report in Flextronic to update tool status on time on server sharepoint.
  • Repaired faults, reassembled products, and completed additional test for RMA product.

Equipment Technician

Kintron
01.2005 - 03.2006
  • Maintained ultrasonic head and spare board good stock levels for manufacturing, counted parts (subcon company).
  • Assembled electrical and electronic high pot tester for cable jig test and aligned parts and fixtures using hand and Milling machine jig fabrication power tools.
  • Inspected all work for quality and compliance with design standards follow by spec define by test engineer.
  • Performed assembly of products according to specifications and instructions.
  • Kept work areas organized, tidy, and clean for tooling shop fabrication room.

Education

Bachelor of Engineering - Electrical, Electronics Engineering Technologies

University of Northumbria
New Castle
04.2009 - 04.2013

High School Diploma -

Polytechnic
Kota Bahru
01.2001 - 12.2004

SPM

SMKY Secondary School
Yan, Kedah
04.2001 -

Skills

    Manufacturing Method Selection

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Design and repair

Like to design and repair the bad electronic and electrical part

Timeline

Bachelor of Engineering - Electrical, Electronics Engineering Technologies

University of Northumbria
04.2009 - 04.2013

Process and Equipment Engineer

Intel Technology
06.2008 - Current

Final Test Technician

Flextronic
03.2006 - 06.2008

Equipment Technician

Kintron
01.2005 - 03.2006

SPM

SMKY Secondary School
04.2001 -

High School Diploma -

Polytechnic
01.2001 - 12.2004
KOK BENG HONGProcess And Equipment Engineer