

Results-driven engIneer with a Ph.D. In Material Engineering and over 7 years of experience in the semiconductor industry, specializing in Si and SiC technologies, chip-package interaction, failure analysis, and interconnect reliability. Expertise in frontend-backend integration, driving technology transfer, and process optimization. Proven ability to solve critical customer issues, enhance yield performance, and drive research innovation. Recognized for technical excellence with spot awards and multiple invention disclosures.
Semiconductor Industry (Si & SiC): Chip-Package Interaction & Interconnect Reliability
Chip-Package (Si & SiC) Failure Analysis
Advanced Interconnect Technologies & Characterization
Technology Transfer & Cross-Functional Collaboration
Material Characterization & Root Cause Analysis
Academic Mentorship & Technical Training