JOEL DENZEL

Seasoned Process Technician with a proven track record of ensuring optimal workflow and efficient production in large-scale semiconductor products. Bringing forth an in-depth understanding of process work like SPC, MTBA and strong technical abilities relating to working with the machines used during production. Adept in trouble-shooting and working to offer solutions. Experienced in identifying issues and repairing mechanical and electrical defects. A strong team player with excellent collaboration skills, and a commitment to maximizing the production process within a facility.

• BGA WB Process TEAM Achievement
• BGA Wire bonder MTBA average at 2.32hr vs goal 2.0hr for (all in) - Meeting the Goal.
• EX1p Plus Implementation successfully migrated to RRU2 device - meeting goal.
• ProCu Kit Plus Implementation as of Q3'24 for Pd Cu wires - 100% implemented (Meeting goal).
• Process technicians trained to assess and release based on the disposition from the 'Cook Book'.
• Zero quality issues after conversion (meeting goal).
• Completed migration of PQ27A/E devices from ASM E60/AP machines to K&S ICONN (meeting goal).
• Cost avoidance of $88K on wire bonder power supply and PCOAB board repairing by technician (FE WB team).
• BGA LOH Generation support meeting goals as per Q3'24 (actual 9% vs goal 10%) - meeting goal.
• Audit: Pass GMA assessment, IFTA audit and customer audits without non-compliance - meeting goal.