Summary
Overview
Work History
Education
Skills
Additional Information
Accomplishments
Timeline
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Nur 'Izzati Binti Zailan

Reliability Qualification Engineer
Rawang, Selangor,10

Summary

Engineer with ten years of experience in Semiconductor industry with 3 years specializing in Test Product Engineering, Automatic Testing Equipment, Data Analysis and 7 years specializing in Reliability Engineering Process, Stress test, hardware and execution including the Construction Analysis. Competent Engineering professional offering foundation in engineering project management. Detail-oriented with knowledge of Process and Product Quality and enthusiastic team player that ready to contribute to company success.

Overview

11
11
years of professional experience

Work History

Reliability Qualification Engineer

NXP Semiconductor
2021.01 - Current
  • Managed reliability NPI/NTI/CM qual execution follow Project Management BCAM7 approach.
  • Performed risk assessment to mitigate any risk during qualification.
  • Track all qual progress (execution and rejects) to ensure everything running as per plan.
  • Coordinated on failure progress with external team (Business line, Package Engineering and Failure analysis)
  • Reviewed qualification plan to ensure all reliability study covered all expected failure mode.
  • Lead on CSAM tool team and active team member for Construction Analysis, Quartz, Reliability Monitoring tool team.

Reliability Engineer

NXP Semiconductor
2016.10 - 2021.01
  • Managed qualification execution progress successfully until product release.
  • Executed reliability stress and analysis (MSL, HAST, THB, ESD stress and CSAM)
  • Ensured all reliability stress running smooth without any delay on plan.

Test Product Engineer

NXP Semiconductor
2013.07 - 2016.10
  • Work closely with supply chain operation, microcontroller engineering team and production planner to support critical automotive customer demand.
  • Performed first level of electrical failure troubleshooting, debug and data analysis.
  • Coordinate test area for product and maintain product volume ramp up and yield/production performance improvement.
  • Carry out qualification and evaluation project for new test flow and product improvement

Education

Bachelor of Engineering (Hons.) Electronics - Electric And Electronic

Universiti Teknologi MARA (UiTM)
Shah Alam, Selangor, Malaysia
2001.04 -

Diploma of Electrical (Electronic) Engineering - Electrical And Electronic

Universiti Teknologi MARA (UiTM)
Shah Alam, Selangor, Malaysia
2001.04 -

Skills

Process Improvement

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Additional Information

  • Tool team leader for CSAM, MSLA and Precond Process
  • Super 5S (7S) zone leader
  • Six Sigma Yellow Belt

Accomplishments

  • Bravo Award for Test2: Hip7NVM Yield Improvement Project
  • Bravo Award for J750 Platform Retest OEE Lost Reduction Project
  • Bravo Award for UflexB OTW Improvement

Timeline

Reliability Qualification Engineer

NXP Semiconductor
2021.01 - Current

Reliability Engineer

NXP Semiconductor
2016.10 - 2021.01

Test Product Engineer

NXP Semiconductor
2013.07 - 2016.10

Bachelor of Engineering (Hons.) Electronics - Electric And Electronic

Universiti Teknologi MARA (UiTM)
2001.04 -

Diploma of Electrical (Electronic) Engineering - Electrical And Electronic

Universiti Teknologi MARA (UiTM)
2001.04 -
Nur 'Izzati Binti ZailanReliability Qualification Engineer