Nur 'Izzati Binti Zailan
Reliability Qualification Engineer
Rawang, Selangor,10
Summary
Engineer with ten years of experience in Semiconductor industry with 3 years specializing in Test Product Engineering, Automatic Testing Equipment, Data Analysis and 7 years specializing in Reliability Engineering Process, Stress test, hardware and execution including the Construction Analysis. Competent Engineering professional offering foundation in engineering project management. Detail-oriented with knowledge of Process and Product Quality and enthusiastic team player that ready to contribute to company success.
Overview
11
11
years of professional experience
Work History
Reliability Qualification Engineer
NXP Semiconductor
01.2021 - Current
- Managed reliability NPI/NTI/CM qual execution follow Project Management BCAM7 approach.
- Performed risk assessment to mitigate any risk during qualification.
- Track all qual progress (execution and rejects) to ensure everything running as per plan.
- Coordinated on failure progress with external team (Business line, Package Engineering and Failure analysis)
- Reviewed qualification plan to ensure all reliability study covered all expected failure mode.
- Lead on CSAM tool team and active team member for Construction Analysis, Quartz, Reliability Monitoring tool team.
Reliability Engineer
NXP Semiconductor
10.2016 - 01.2021
- Managed qualification execution progress successfully until product release.
- Executed reliability stress and analysis (MSL, HAST, THB, ESD stress and CSAM)
- Ensured all reliability stress running smooth without any delay on plan.
Test Product Engineer
NXP Semiconductor
07.2013 - 10.2016
- Work closely with supply chain operation, microcontroller engineering team and production planner to support critical automotive customer demand.
- Performed first level of electrical failure troubleshooting, debug and data analysis.
- Coordinate test area for product and maintain product volume ramp up and yield/production performance improvement.
- Carry out qualification and evaluation project for new test flow and product improvement
Education
Bachelor of Engineering (Hons.) Electronics - Electric And Electronic
Universiti Teknologi MARA (UiTM)
Shah Alam, Selangor, Malaysia 04.2001 -
Diploma of Electrical (Electronic) Engineering - Electrical And Electronic
Universiti Teknologi MARA (UiTM)
Shah Alam, Selangor, Malaysia 04.2001 -
Skills
Process Improvement
Root Cause Analysis
System Troubleshooting
Project Management
Manufacturing Processes
Data Analysis
Reliability
Team Collaboration
Additional Information
- Tool team leader for CSAM, MSLA and Precond Process
- Super 5S (7S) zone leader
- Six Sigma Yellow Belt
Accomplishments
- Bravo Award for Test2: Hip7NVM Yield Improvement Project
- Bravo Award for J750 Platform Retest OEE Lost Reduction Project
- Bravo Award for UflexB OTW Improvement
Timeline
Reliability Qualification Engineer
NXP Semiconductor
01.2021 - Current
Reliability Engineer
NXP Semiconductor
10.2016 - 01.2021
Test Product Engineer
NXP Semiconductor
07.2013 - 10.2016
Bachelor of Engineering (Hons.) Electronics - Electric And Electronic
Universiti Teknologi MARA (UiTM)
04.2001 -
Diploma of Electrical (Electronic) Engineering - Electrical And Electronic
Universiti Teknologi MARA (UiTM)
04.2001 -