HARIZ ABDUL MANAB
Product Development And Quality Engineer
George Town, Penang
Summary
Results-driven professional with over 7 years of engineering experience specializing in spearheading continuous improvement initiatives within Product Development and Quality Engineer roles. Seeking a challenging test engineering role focused on innovative solutions for complex IC devices with a strong emphasis on product quality and reliability. Dedicated, detail-oriented individual committed to advancing the corporate mission. Skilled in troubleshooting failures, analyzing test and reliability data, and collaborating with teams to enhance yield and overall device quality and reliability. Possesses a deep understanding of reliability testing methodologies for robust semiconductor products.
Overview
9
9
years of professional experience
Work History
Product Development and Quality Engineer
MPE BI Dept. Intel
01.2022 - Current
- Led the development of a pioneering burn-in test program to demonstrate the capabilities of the new Automated Test Equipment (ATE) called HBI, using Server product as the pilot.
- Owner of thermal and logic test for Server and ASIC products in burn in test program development, ensuring compliance with industry standards and meeting critical product timelines without compromising quality and reliability criteria.
- Designed and optimized a novel logic test approach based on the scan chain test method for the ASIC burn-in test program, resolving the toggle monitor breakdown issue and achieving 96.48% content coverage.
- Tailored the logic stress test module for Server and ASIC products to meet required stress test time, achieving 100% content pass rate during validation based on product PHI.
- Collaborated with key players across design, development, manufacturing (in-house OSAT) and quality teams and conducted various experiments to enhance thermal and power performance of Server and ASIC product, successfully resolving high PBIC fallout showstopper issues.
- Facilitated training and sharing sessions for team members on workflow standardization, streamlined content requirements in test program and best known method (BKM) in engineering work, enhancing overall competency levels within the department.
Product Development Engineer
MPE DDG Client Dept. Intel
01.2019 - 01.2022
- Assigned as a Test Program Integrator (TPI) for Mobile product in CLASS test program development.
- Enabled the first IntraDUT Test Program (TP) in High Volume Manufacturing (HVM) to support Mobile product Output Max requests, achieving a 12-second Test Time Good (TTG) saving and enhancing the product test capacity by 15%.
- Coordinated the USB2 SOF experiment for data collection on good/bad units in factory for both ATE platforms, resolving the USB2 MRB screen issue and improving yield by 3-4%.
- Delivered two key class test programs for HVM, enabling the first High Voltage Burn In (HVBI) TP and saving 100% of the time previously spent running units at LCBI, resulting in complete cost savings at LCBI.
- Supported and coordinated EQA Reject Validation, leading to the elimination of EQA monitoring.
- Collaborated with ATM partners to enable MSG TP correlation in ATM and RA QnR labs, releasing PG7 x10 capacity for key Desktop Product 1st Si Power On and HVM ramping activities.
- Enabled EQA testing at 95C for Mobile and Desktop Products, eliminating the product CSM monitoring and supporting multiple EQA data collections at 95C for DPM assessment, resulting in significant yield recovery and a 2% yield improvement.
- Delivered Mobile Product EOL Class Test Program by week 52 of 2020, freeing up 100% lab capacity for Desktop Product ramping and improving work activity efficiency by 50%.
Product Development Engineer
MPE HVE Dept. Intel
01.2018 - 01.2019
- Enhanced team performance by testing RV units on the HDMx/CMT ATE platform, ensuring efficient execution.
- Coordinated multiple Walk The Lot (WTL) sessions on the ATE platform, ensuring test program readiness before production release.
- Owned Server Products Quality Assurance Monitoring (EQAM) and Cold Socket Elimination (CSE), leading monitoring, analysis, and DPM assessment, and collaborating with divisions to address top pareto bin fallout issues.
- Validated and analyzed new Class Test Programs (RCO, ES, QS, PRQ) for Server products, ensuring robust performance.
- Analyzed daily yield data and performed bin analysis on Server products to identify and resolve issues.
- Managed lot on-hold issues at OLB for Server products, ensuring timely resolution.
Process Engineer
Cement Industries of Malaysia,CIMA
10.2017 - 12.2017
- Gained comprehensive understanding of the cement production process, from raw materials to finished products.
- Conducted inspection and maintenance of the kiln, ensuring optimal operation.
- Participated in a task force to improve site maintenance operations, driving efficiency improvements.
SRT Rework Engineer
Jabil Circuit Sdn. Bhd
01.2016 - 08.2016
- Developed lead-free thermal profiles for Surface-Mount Devices (SMD) in the Manufacturing Engineering (ME) department, enhancing localized rework processes.
- Inspected and maintained SRT rework machines, including pneumatic actuators, top/bottom heaters, and stepper motors, and understood software interfaces.
Education
Masters of Engineering in Microelectronics - Microelectronics
Multimedia University, MMU
Cyberjaya, Selangor, Malaysia 04.2001 -
Bachelor of Enginering (Hons) - Electrical And Electronics Engineering
University Technology of PETRONAS
Seri Iskandar, Perak, Malaysia 04.2001 -
SPM - Pure Science
MARA Junior Science College Transkrian
Nibong Tebal, Penang, Malaysia 04.2001 -
Skills
Quality and reliability improvement for thermal and logic test in burn in and class test program
Test Program Development (TPD) using languages like Verilog, VHDL, python, C
Integrated Development Environment (IDE) such as TPIE, GitHub, TORCH, ARDUINO
Data analysis tools like TRACE, SQL, AQUA, Crystal Ball, Catalyst, JMP
In House Automated Test Equipment (ATE) operation and maintenance for CMT, HDMT and HBI
Knowledge on Failure Analysis (FA) techniques and root cause identification
Digital and Analog Design Fundamentals
Thermal and Logic Test methodology development and optimization for reliability test
JEDEC Standards and Test Specification
Documentation and reporting
Root-cause analysis
Excellent communication, collaboration and problem-solving skills
Timeline
Product Development and Quality Engineer
MPE BI Dept. Intel
01.2022 - Current
Product Development Engineer
MPE DDG Client Dept. Intel
01.2019 - 01.2022
Product Development Engineer
MPE HVE Dept. Intel
01.2018 - 01.2019
Process Engineer
Cement Industries of Malaysia,CIMA
10.2017 - 12.2017
SRT Rework Engineer
Jabil Circuit Sdn. Bhd
01.2016 - 08.2016
Masters of Engineering in Microelectronics - Microelectronics
Multimedia University, MMU
04.2001 -
Bachelor of Enginering (Hons) - Electrical And Electronics Engineering
University Technology of PETRONAS
04.2001 -
SPM - Pure Science
MARA Junior Science College Transkrian
04.2001 -
Similar Profiles
Micheal ReedMicheal Reed
Electrician at Shoals MPEElectrician at Shoals MPE
Ife OyedotunIfe Oyedotun
Junior Mechanical Engineer at MPE, a Division of EnglobeJunior Mechanical Engineer at MPE, a Division of Englobe
Sam CannonsSam Cannons
LEADING HAND/PROJECT MANAGER at MPE GROUPLEADING HAND/PROJECT MANAGER at MPE GROUP
Mohamad Nabeel Abdul HalimMohamad Nabeel Abdul Halim
VS Supervisor at Teleflex Medical Sdn. Bhd.VS Supervisor at Teleflex Medical Sdn. Bhd.
Christine Chuo Yan RuChristine Chuo Yan Ru
Customer Service Specialist at TeleperformanceCustomer Service Specialist at Teleperformance