HAFIZAH ABD WAHAB
Simpang Ampat
Summary
To seek employment in a position which allows me to show and practice Product/Manufacturing/DFM knowledge and experience in the industry and to develop new skills and abilities. Experienced in fast-paced environments and adaptable to last-minute changes. Thrives under pressure and consistently earns high marks for work quality and speed.
Overview
13
13
years of professional experience
Work History
Platform Hardware Manufacturing Engineer
Intel Kulim
04.2021 - Current
- Perform DFM analysis for board assembly (Server xPV, HDMT, CCG, HEDT)
- Provide technical feedback on the manufacturability of product based on BOM and board layout to design team
- Conduct risk assessments to identify potential issues and mitigate risks associated with NPI product
- Develop process flows and manufacturing assembly instructions by referencing customer board file and BOM list
- Purchase necessary tooling for new product and perform tooling design buy off
- Coordinate board assembly teams to execute on NPI projects in a timely manner
- Ensure NPI build execution complies with the board design requirement
- Monitor and improve the yield performance for all NPI build
- Participate in failure analysis, root causes determination and implementation of corrective actions
- Manage product changes (ECO) during sustaining stage
- Conduct design of experiment (DOE) to identify failure root causes and improve product performance
Manufacturing Engineer
Jabil Circuit Penang
Penang
10.2019 - 04.2021
- Manage new product set up (NPI)
- Purchase necessary tooling for new product and perform tooling design buy off
- Analyze product DFM violation and define mitigation plan for risk item
- Scrub BOM received from customer to define part media, process usage, purchase and no-purchase part, prepping part, IDM part etc
- Create product failure mode and effect analysis document
- Develop and optimize process flows and manufacturing assembly instructions by referencing customer assembly drawing and BOM list
- Ensure NPI build execution complies with the board design requirement
- Ensure successful implementation of ECO changes
- Resolve errors encountered in shop floor system (MES)
- Attend to quality issues, providing timely resolutions and RCCA/8D
- Monitor and improve the yield performance for all NPI build
- Resolve and respond to customer complaints regarding process issues
- Communicate with customers regarding product-related matters such as engineering changes and new model development
Product Engineer
Flex Penang, Prai
Penang
05.2016 - 10.2019
- Manage the reception, analysis, and customization of technical information/documentation provided by customers in relation to product specifications for NPI or design changes
- Develop and optimize process flows and manufacturing assembly instructions by referencing customer assembly drawing and BOM list
- Create product failure mode and effect analysis document
- Ensure NPI build execution complies with the board design requirement
- Manage product changes (ECOs/ Deviation) during sustaining stage
- Provide support to production to ensure continuous manufacturing and shipment
- Resolve quality issues promptly
- Contribute to the smooth functioning of rework RMA processes
- Conduct, monitor, and evaluate special build/qualification builds upon customer request
- Coordinate process team for the product yield improvement
- Communicate with customers regarding product-related matters such as engineering changes and new model development
- Resolve product-related problems and conduct failure analysis for issues
- Conduct Design for Manufacturing (DFM) analysis and Design of Experiment (DOE) to identify failure root causes and improve product performance
- Examine customer feedback and conduct thorough investigations to pinpoint the root causes of product failures
- Register and update product BOM in Agile system
- Analysis of customer product parts and assemblies through model files using CAD
- Collaborate with IT department to develop the Flexflow shop floor system and establish process and assembly requirements
- Enhance Flexflow system to prevent process escapee and to streamline the manufacturing process (partial bom , automove station, auto backflush, decombo , partial pack etc)
Production Engineer
Ibiden Electronics Malaysia
02.2014 - 05.2014
- Develop standard work and line balancing to increase productivity
- Monitor and drive continuous yield improvement
- Streamline production processes resulting in increased savings on costs and improve utilization of manpower
- Develop and sustain employee training on lean concepts
Product Engineer
Flextronics Penang, Bukit Minyak
Penang
07.2011 - 01.2014
- Responsible for the implementation of customer product specification and convert customer documentation into Flex standard documentation
- Responsible for assembly process and work instructions
- Manage product configurations and documentation
- Manage product changes (ECOs/ Deviation) during NPI and sustaining stage
- Production run-time support for material and product issues
- Attend to any quality issues arise and provide timely resolutions
- Conduct and monitor special build/qualification build/evaluation upon customer request
- Ensure tooling readiness for NPI build
- Interact with customer and various departments on product related issues, engineering changes, new model development
Education
Bachelor of Electrical Engineering - Electrical, Engineering
Universiti Sains Malaysia (USM)
01-2011
Foundation - Physical Science
Kolej Mara Kulim, Kedah
01-2007
Skills
- Valor software
- Vayo software
- Allegro Cadence software
- ViewMate software
- SAP ME system
- Flexflow system
- Agile system
- MES system
- Agile system
- MES system
- IPC
Language and skills
- Bahasa Melayu - Excellent
- English - Excellent
Hobbies and Interests
Badminton, Travel, Hiking, Camping
Accomplishments
- Successfully perform interplant product transfer for CISCO product without major issue and quality compromise
- Successfully setup new line and project for Universal Robot product
- 1st Runner Up of SIMS Innovation Manufacturing Symposium 2023 in demo competition (Project title: Overcome DDR4/DDR5 rework challenges with breakthrough mini stencil jig)
- 2022 Intel Invention Award (Project title: Solder printing with mini jig with protruded side wall and alignment guide)
- SIMS factory Recognition award for proactive defect detection & prevention
References
Richie Gan +(60)12- 4888207, Board Product Engineering Manager, Intel Products
Timeline
Platform Hardware Manufacturing Engineer
Intel Kulim
04.2021 - Current
Manufacturing Engineer
Jabil Circuit Penang
10.2019 - 04.2021
Product Engineer
Flex Penang, Prai
05.2016 - 10.2019
Production Engineer
Ibiden Electronics Malaysia
02.2014 - 05.2014
Product Engineer
Flextronics Penang, Bukit Minyak
07.2011 - 01.2014
Bachelor of Electrical Engineering - Electrical, Engineering
Universiti Sains Malaysia (USM)
Foundation - Physical Science
Kolej Mara Kulim, Kedah
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