Gopal Subramaniam

Assembly – Microball Attach (U‑Ball)

• Managed U‑Ball manufacturing processes, focusing on defect reduction and yield improvement.
• Investigated microball attach defects through root cause analysis and implemented corrective actions.
• Optimized process parameters, stencil performance, and material usage to improve solder ball quality.
• Collaborated with production, quality, and engineering teams to resolve process‑related issues.
• Monitored SPC and quality trends to ensure process stability and product reliability.

Project: Juniper Networks Aug 2021 – Feb 2026 (4 years 7 months)

• Executed quarterly ORT (Online Running Test) plans, identifying and resolving failures to improve product reliability.
• Conducted root‑cause analysis and debugging, reducing invalid failures and retest lots.
• Collaborated with cross‑functional teams to validate fail boards and support customer issue resolution.

Project: Fortive Nov 2019 – Jul 2021 (1 year 9 months)

• Performed preventive maintenance and troubleshooting on ICT HP 3070 fixtures, improving equipment uptime and test reliability.
• Supported TAKAYA (FP) and FT programming activities, ensuring accurate board validation and smooth production flow.
• Executed board programming (JTAG, TestStand, FT) and validated NPI products before release to production, reducing test cycle time and defects.

Project: Bose Dec 2017 – Oct 2019 (1 year 10 months)

• Maintained LabVIEW programs and SPI programming tools, enhancing test automation accuracy.
• Configured and optimized NI PXIe chassis systems, reducing equipment downtime and improving yield.
• Led troubleshooting and preventive maintenance efforts, minimizing retest cycles and boosting production efficiency.

Project: Juniper Networks (Plan P1) Jan 2014 – Nov 2017

(3 years 11 months)

• Set up and validated test databases, log files, and Linux upgrades to support new product introductions (NPI).
• Designed debug scripts and provided customer support for server/script issues, ensuring smooth test execution.
• Validated fail boards and performed board programming (Quartus II, LTC), improving test coverage and reliability.

Project: BlackBerry (Plan P1 & 3) Aug 2011 – Dec 2013

(2 years 5 months)

• Troubleshot testers and minimized downtime, improving product test yield and reducing cycle time.
• Conducted equipment inspections using advanced tools (N8960, N48, audio frequency generators), ensuring accuracy and compliance.
• Led initiatives to reduce test measurement cycle time, achieving faster throughput and improved efficiency.

• Troubleshot and maintained ICT HP 3070 and RTS systems, improving equipment uptime and test reliability.
• Copied and configured test programs across production lines via IP address, ensuring consistent test performance and data integrity.
• Repaired and upgraded test fixtures, reducing downtime and improving test accuracy.
• Conducted GR&R (Gauge Repeatability and Reproducibility) studies to validate tester precision and measurement consistency.
• Implemented preventive maintenance schedules and part replacement plans, extending fixture lifespan and minimizing unexpected failures.