FOO SOW MUN
Senior Staff Packaging Design Engineer
BAYAN BARU
Summary
Experienced with advanced engineering principles and leading technical teams. Utilizes innovative problem-solving skills and project management expertise to drive efficiency and quality. Knowledge of system design and process optimization, supporting effective cross-functional collaboration.
Senior engineering professional with robust experience in designing and implementing scalable systems. Demonstrates strong technical skills in software architecture, coding, and systems integration. Excels in team collaboration to deliver high-impact results and adapts seamlessly to changing project requirements. Known for reliability, effective problem-solving, and strategic approach to project execution.
Overview
28
28
years of professional experience
5
5
years of post-secondary education
1
1
Language
Work History
Senior Staff Engineer Package Technology
Infineon Technologies
07.2022 - Current
- Be the driver for technical definition (BOM, package design. Assembly technology, review PRP, project classification,etc) activities for package projects with major changes/new packages, risk and impact.
- Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
- Define the package characteristics to meet the electrical thermal,reliability and mechanical requirements.
- Coordinate the package cost estimation(A1-A3) and cost indication (A3).
- Be the contact partner and technical consultant for package definition to the business division especially on BE assembly technology know-how.
- Support the pre-development & project definition stage and continue to be the package design experts throughout the project phrase.
- Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
- Consolidate the inputs for ADR and ensure the contents and updated (A project).
- Be the main contact person and technical consultant/coach for all questions and discussions regarding packaging, package design and package.
- Drive innovations and pre-development activities within the package platform.
Senior Packaging Design Engineer
Molex Malaysia Sdn Bhd
02.2022 - 06.2022
- Collaborated with cross-functional teams to ensure seamless integration of engineering designs into final products.
- Brainstormed with product designers to implement and refine new manufacturing processes.
- Solved complex design challenges, resulting in highly functional and aesthetically pleasing products.
- Led design reviews and provided critical feedback for continuous improvement in product quality.
- Enhanced product design efficiency by streamlining prototype development process.
- Engaged in continuous professional development to enhance technical and design skills, staying ahead in competitive industry.
Structural/Physical Design Engineer
CLE PSG Intel M’sia
01.2021 - 01.2022
- Creates bottoms-up elements of Server, Networking, and Emerging Data Center + Custom ASIC SOC design including but not limited to synthesis, partition level floorplan, abstract view generation, RC extraction and schematic-to-layout verification and debug using phases of physical design development including parasitic extraction, static timing, reliability analysis, clock generation, custom polygon editing, auto-place and route algorithms, floor planning, full-chip assembly, and verification.
- Troubleshoots a wide variety up to and including difficult design issues and applied proactive intervention. Executes and verifies complex chips development and execution of project methodologies and/or flow developments. Requires expansive knowledge and practical application of methodologies and physical design. Innovation and efficiency improvement in the day-to-day execution is an added expectation.
- Knowledge of silicon design & experience in structural physical design.
- v Familiar with programming skills in Perl and TCL Good communication and strong analytical skills.
- Knowledgeable in 5G, AI, networking architecture, and hardware design
Senior Packaging R&D Engineer
ePG Intel M’sia
07.2019 - 12.2020
- Design with custom & Drop In Replacement die from eASIC team.
- Experience in designing for high-speed parallel bus interfaces such as DDR3, DDR4, LPDDR3, LPDDR4 or high-speed SerDes interface is a plus.
- Design conceptual understanding of impedance matching, S-parameter and crosstalk.
- Understanding of signal integrity and power integrity.
- Good conceptual understanding of impedance matching, S-parameter and crosstalk.
- Manage the project delivery schedule and deal with different site of team members in a fast-paced and high-volume environment with emphasis on accuracy and timeliness.
Technical Program Manager (NPI)/TPM Cum Package Design Engineer
TF AMD
07.2017 - 06.2019
- Leading projects to implement new technology realization by setting up project framework, team formation, initiate budgets, communication, and milestone/cost tracking.
- Manage the development of assembly equipment infrastructure and solutions to meet the new production needs of company.
- Lead and liaise with internal customer to plan, execute and result review on engineering activities for product bring up.
- Accountable in overseeing (End to end) and provide direction to entire execution of the project technically.
- To conduct technical feasibility check, define criticalness correlate to customer special requirement and bridging solutions accordingly.
- Drive individual engineering team on qualification of equipment for product bring up.
- Work with various process and equipment team in defining the new product requirement and support customer technical request.
- Drive cross function team in project initiating, planning, monitoring, and execution to meets project scope in term on cost, timeline and quality requirement.
- Provide update in various forum to keep stakeholder aware of latest development status on the new product bring up.
- Communicates with team member so that all goals, expectations, and performance as compared to plan are well understood.
- Research the advance packaging technology roadmap and understand feasibility.
- Provide forecast and manage budget requirement for the new product bring up.
- Support production as needed on yield improvement and cost reduction
Physical Design Engineer
Oppstar Technology
01.2016 - 06.2016
- Familiar with industry physical design standard EDA tools such as Synopsys IC Compiler, PrimeTime, IC Validator, Cadence Encounter, Mentor Graphics Calibre etc.
- Hands-on experience in floor planning, clock tree synthesis, timing closure, signal integrity check, IR drop analysis, ECO implementation and physical verification.
- Experience in implementing Place & Route tasks from RTL to GDS, STA and timing closure, power/reliability verification and physical verification.
- Hands-on experience in scripting languages such as Perl, Tcl etc.
Package Design Engineer
CCG Intel M’sia
03.2005 - 09.2015
- Responsible for the project management and the delivery of the package design tape-out.
- Scope all the package design requirement and document in the Package Design Requirement Document PDRD.
- Need to ensure compliance which includes electrical performance meeting the requirement through the package design and delivery of the design collaterals.
- Responsible for leading product design from the planning phase all the way to design tape out and providing support to the stakeholders post tape-out if required. The responsibilities include but not be limited to.
- Leading the Package Design Working Group PDWG to work with key internal/external partners to comprehend the detail design requirements.
- Managing the package design schedule partnering with stakeholders to ensure package tape-out per schedule.
- Good understanding of the Package/Assembly cost and leveraging design methods to lower the package cost.
- Leading the package design reviews to ensure stakeholder approval and design compliance with requirements. Documenting the detailed design requirements clearly in the PDRD.
- Using the CAD software to design the substrate in compliance with existing design rules, electrical requirements, and processes.
- Providing route and fit studies for design tradeoff.
- Generating high quality design documents in timely manner for manufacturers and package assembly modules.
- Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to Intel.
- Pathfinding & prove of concept to develop a new innovation design.
- Component’s placement studies.
NPI Production Supervisor
Finisar Ipoh
04.2004 - 02.2005
- NPI & outsource product transfer experience.
- Oracle & System clean up coordinator for the production area.
- Material Shortages Coordinator for the Production area.
- Coordinator from production side to raise an ECR & ECO for engineering change purpose.
Production Supervisor
Agilent Technologies
10.2002 - 04.2004
- NPI & outsource product transfer experience.
- Oracle & System clean up coordinator for the production area.
- Material Shortages Coordinator for the Production area.
- Coordinator from production side to raise an ECR & ECO for engineering change purpose.
Process & Production Technician
TFP Precision Industries Sdn. Bhd.
08.1999 - 10.2002
- Preparing the evaluation of the gap measurement, drop test, chamber test & loose test.
- Time study for the line balancing record.
- Achieve the production output, performance, quality & productivity.
- Preparing the monthly bookkeeping inventory report.
- Setting up of new production line.
- Repairing various machinery & PCBA including the Screw Dispenser, Functional Testing Jig and the Functional Jig Wire.
- Study & analyze the concept of QCC, 7 QC Tool & 5S.
- Preparing the SPVR, Q-Plan, Work Guide data of the new project.
- Study & troubleshoot the Yamaha DVD Failure set.
Technical Assistant
Digimatic Technology
04.1998 - 04.1999
- Troubleshot malfunctioning hardware and software deployments to support nonstop operations.
- Set up and configured desktop computers, peripherals and accounts, assigning appropriate security levels.
- Installed technical hardware and software in deskside support environment.
- Liaised with customers, communicating and resolving problems and concerns.
Draughts person
ZAIDUN-LEENG Sdn. Bhd.
01.1997 - 06.1997
- Autocad electrical single line & building services layout & drawing.
- Preparing alternate drawings to local authorities for approval
Education
BTEC HND - Electrical / Electronic
The Nottingham Trent University
01.1997 - 01.1998
Certificate - Electrical Power Engineering
Port Dickson Polytechnic
Si Rusa, Negeri Sembilan 01.1995 - 01.1997
SPM - undefined
Sekolah Menengah Seri Puteri
Ipoh, Perak 01.1992 - 01.1994
Skills
Package design
Cost estimation
Technical consulting
Project management
Process improvement
New technology scouting
Risk assessment
Extracurricular Activities
06/01/01, QCC Team Leader from Accessory Department in TFP Precision Industries Sdn. Bhd. Ipoh. 01/01/95, 12/31/97, Electrical Department’s badminton player. 01/01/92, 12/31/94, Committee member of the Art club of Sekolah Menengah Seri Puteri, Ipoh.
Other Information
Registered as a qualified engineering technician with title of ‘EngTech’ in both Engineering Council (UK) and Institution of Incorporated Engineers (IIE, UK), Member of The Electrical And Electronics Association of Malaysia (TEEAM), Registered as a Graduate member of The British Computer Society, Cantonese, Mandarin, English, Bahasa Melayu, Chinese, English, Bahasa Melayu, Driving license and own vehicle, Enjoy travelling and meeting people, Common software packages usage, Playing badminton, swimming, and listening to music
Addresses
5-13A-2, PROMONADE, PERSIARAN MAHSURI, BAYAN BARU, PULAU PINANG, 11900, 56, LEBUH WAH KEONG, TAMAN WAH KEONG, IPOH, PERAK DARUL RIDZUAN, 31400
Ic Number
- A 3120783 (old)
- 750729-08-5612 (new)
Hp Number
012-4510714
Epf Number
14674351
Sosco Number
Y9900278P
Personal Information
- Ethnicity: Chinese
- Date of Birth: 07/29/75
- Gender: Female
- Nationality: Malaysian
- Marital Status: Single
Hobbies
- Hiking
- Cardio
- Running
Timeline
Senior Staff Engineer Package Technology
Infineon Technologies
07.2022 - Current
Senior Packaging Design Engineer
Molex Malaysia Sdn Bhd
02.2022 - 06.2022
Structural/Physical Design Engineer
CLE PSG Intel M’sia
01.2021 - 01.2022
Senior Packaging R&D Engineer
ePG Intel M’sia
07.2019 - 12.2020
Technical Program Manager (NPI)/TPM Cum Package Design Engineer
TF AMD
07.2017 - 06.2019
Physical Design Engineer
Oppstar Technology
01.2016 - 06.2016
Package Design Engineer
CCG Intel M’sia
03.2005 - 09.2015
NPI Production Supervisor
Finisar Ipoh
04.2004 - 02.2005
Production Supervisor
Agilent Technologies
10.2002 - 04.2004
Process & Production Technician
TFP Precision Industries Sdn. Bhd.
08.1999 - 10.2002
Technical Assistant
Digimatic Technology
04.1998 - 04.1999
Draughts person
ZAIDUN-LEENG Sdn. Bhd.
01.1997 - 06.1997
BTEC HND - Electrical / Electronic
The Nottingham Trent University
01.1997 - 01.1998
Certificate - Electrical Power Engineering
Port Dickson Polytechnic
01.1995 - 01.1997
SPM - undefined
Sekolah Menengah Seri Puteri
01.1992 - 01.1994
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