CHI YING TAN
Materials Engineering
Simpang Empat, Penang
Summary
PhD graduate with strong expertise in soldering materials, failure analysis, and advanced characterization. Led collaborative research on synchrotron techniques, with 4 publications and international presentations. Proven ability to develop innovative material solutions, enhance product reliability, and drive cross-functional engineering improvements—ready to contribute to advancements in the electronic industry.
Overview
7
7
years of professional experience
Work History
Senior Materials Engineer
Sophic Automation X Keysight Technologies
11.2024 - Current
- Served as a subject matter expert on materials engineering topics within interdisciplinary team discussions and decision-making processes.
- Lead part qualification and value engineering projects to improve gross margin.
- Collaborate with R&D, procurement, and product engineering to define material specifications, and resolve technical issues.
- Conduct failure analysis (FA), root cause analysis (RCCA), and support cross-functional improvement initiatives.
- Manage relationships with contract manufacturers and PCB suppliers to ensure supply consistency and quality.
Graduate Research Assistant
Universiti Malaysia Perlis
01.2020 - 10.2024
- Working on an industrial collaboration research project and the Fundamental Research Grant Scheme (FRGS) project.
- Focuses on the development of synchrotron techniques and the grain refinement of Sn-based solder joints.
- Design, perform, and analyze research projects, including sample fabrication, data collection, and data analysis.
- Focus on micro-alloying properties, material characterization, kinetic growth, solidification behaviors, crystallography, and interconnect reliability.
- Supervised and advised final-year undergraduate and master's students in conducting lab work and data analysis.
- Attached with the Super Photon Ring 8-GeV, Japan, and the Synchrotron Light Research Institute (SLRI), Thailand, for synchrotron techniques development.
R&D Engineer Trainee
Penchem Technologies Sdn Bhd
06.2018 - 08.2018
- Involved in LED encapsulation R&D project.
- Executed a comprehensive reliability simulation for adhesive and encapsulating materials, including accelerated heat aging tests, UV aging, moisture sensitivity level testing, sulfur corrosion testing, reflow, die shear, and moisture absorption.
- Utilize analytical techniques, such as rheometry, DSC, TGA, and FTIR, to gain insights into material behaviors and performance.
Education
Ph.D. - Materials Engineering
Universiti Malaysia Perlis
04.2001 -
Bachelor of Engineering - Materials Engineering
Universiti Malaysia Perlis
01.2015 - 01.2019
Sijil Tinggi Persekolahan Malaysia (STPM) -
SM Impian Bukit Mertajam
01.2013 - 01.2014
Skills
Failure analysis
Research and development
Problem-solving
Team collaboration
Materials analysis
Soldering Materials / SMT process
Accomplishments
- Third Place for the Three-Minute Thesis (3MT) Competition UniMAP 2023
- Semi-finalist in 2023 Three-Minute Thesis (3MT) Competition (National level)
- Consolation Prize for TOP 10 Participants in Malaysia Nanotechnology Olympiad Competition (ONM) National Level 2021
- Gold Medal for project 'Natural NANOtech Sensor' in Malaysia Nanotechnology Olympiad Competition (ONM) National Level 2021
- Silver Award for project 'Grain Refined Lead-free Solder For Aerospace Application' in EREKA 2020 UniMAP.
- Gold medal for project 'Superconducting Interconnect For Future 5G Electronic Application' in 31st International Invention, Innovation & Technology Exhibition 2020.
Research Publications
- Effect of Vanadium on the Properties of Sn-3wt%Ag-5wt%Cu Solder Alloy, Tan, C. Y., Mohd Salleh, M. A. A., Saud, N., Nishimura, T., & Nogita, K., 07/01/24, Journal of Materials Science: Materials in Electronics
- A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography, Tan, C. Y., Mohd Salleh, M. A. A., Saud, N., Nabialek, M., & Rylski, A., 2024, Archives of Metallurgy and Materials
- Grain refinement of primary Cu6Sn5 in the Sn-3wt% Ag-5wt% Cu alloy by Ge, Tan, C. Y., Salleh, M. M., Saud, N., Chaiprapa, J., & Nogita, K., 2022, Journal of Materials Research and Technology
- Properties of Sn-3 wt% Ag-5 wt% Cu alloys with Cu6Sn5 intermetallics grain refined by Mg, Tan, C. Y., Salleh, M. M., Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I. I., & Nogita, K., 2022, Materials Today Communications
- The effect of germanium addition on the lead-free solder alloys: a short review, Tan, C. Y., Salleh, M. A. A. M., & Saud, N., 10/01/20, IOP Conference Series: Materials Science and Engineering
- The study of interfacial reaction between SnAgCu (SAC) lead-free solder alloys and copper substrate: a short review, Tan, C. Y., Salleh, M. A. A. M., & Saud, N., 06/01/20, IOP Conference Series: Materials Science and Engineering
- The effect of Aluminium addition on the microstructure of lead-free solder alloys: A short review, Tan, C. Y., & Salleh, M. A. A. M., 12/01/19, IOP Conference Series: Materials Science and Engineering
- The influence of sintering temperature on the pore structure of an alkali-activated kaolin-based geopolymer ceramic, Ramli, M. I. I., Salleh, M. A. A. M., Abdullah, M. M. A. B., Aziz, I. H., Ying, T. C., Shahedan, N. F., ... & Burduhos Nergis, D. D., 2022, Materials
Oral presentation
- The Minerals, Metals, & Materials Society (TMS) 2023, 03/19/23, San Diego, California, USA
- Green Materials and Electronic Packaging Interconnection Technology Symposium (EPITS) 2022, 09/13/22, Langkawi, Kedah, Malaysia
- Green Materials and Electronic Packaging Interconnection Technology Symposium (EPITS) 2019, 11/24/19, Penang, Penang, Malaysia
Timeline
Senior Materials Engineer
Sophic Automation X Keysight Technologies
11.2024 - Current
Graduate Research Assistant
Universiti Malaysia Perlis
01.2020 - 10.2024
R&D Engineer Trainee
Penchem Technologies Sdn Bhd
06.2018 - 08.2018
Bachelor of Engineering - Materials Engineering
Universiti Malaysia Perlis
01.2015 - 01.2019
Sijil Tinggi Persekolahan Malaysia (STPM) -
SM Impian Bukit Mertajam
01.2013 - 01.2014
Ph.D. - Materials Engineering
Universiti Malaysia Perlis
04.2001 -
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