Summary
Overview
Work History
Education
Skills
Patents Awards
Programming/ Scripting
Applications
Languages
Interests
Work Preference
Timeline
Hi, I’m

Chee Beng Ng

SENIOR PRODUCT DEVELOPMENT ENGINEER
Permatang Pauh, Penang,07
Chee Beng Ng

Summary

Project lead with 5 years of working experience in developing products from customer specifications. Good collaboration skill with multi stakeholders (engineering team, lab, factory, project management team, quality&reliability team, OEM, procurement team, etc) to deliver projects successfully. 15 years of engineering related knowledge like PCB design, schematic drawing, acoustic test, EE system test, battery life test, range test, USB test etc. Multi-tasking with several role in a projects.

Overview

15
years of professional experience

Work History

Intel Microelectronics (M) Sdn. Bhd

Senior Product Development Engineer
03.2022 - Current

Job overview

  • 2 years of working experience in Burn In Team.
  • Responsible for multiple key roles within the Burn In
    process for next-generation client computing
    products. These roles include serving as the Project
    Lead, Burn In Board Hardware Owner, and Test
    Program Module Owner.
  • As the product Burn In Lead, I collaborate closely
    with the team to ensure the timely delivery of
    factory and qualification High-Density Burn-In
    (HDBI) test programs for each milestone, in
    alignment with the planned HDBI test program
    roadmap. My role involves coordinating efforts to
    meet deadlines and maintain adherence to the
    established schedule, ensuring that all deliverables
    are completed on time and meet quality
    standards.
  • Collaborate extensively with a range of
    stakeholders, including factory teams, laboratories,
    functional teams, design teams, project
    management, and quality and reliability teams, to
    drive the development of Burn-In Boards and
    associated test programs.
  • As the Burn In Board Hardware Owner, I am
    responsible for designing and validating Burn-In
    Boards engineered to rigorously stress chipset
    products under extreme conditions. My role
    involves close collaboration with tester module designers and lab/factory coordinators to set up
    and validate the tester systems, ensuring they are
    fully operational before initiating test program
    activities.
  • As the Test Program Module Owner, I am
    responsible for the development, validation, and
    debugging of reset, fuse, and array modules within
    the test program. My role ensures the seamless
    integration and functionality of these modules
    throughout the test program development
    process, contributing to the overall accuracy and
    effectiveness of the testing operations

Motorola Solutions Inc

Senior Electrical Engineer
06.2010 - 03.2022

Job overview

  • 12 years of working experience in the Accessories
    Team.
  • Provide EE support for EE related issues of MOL
    (maintenance on line) issue and PCN (part
    change notice) – year 2010 to 2021.
  • Support system test, acoustic measurement of
    Wireless dongle – year 2010 to 2013.
  • Support system test, power management,
    Bluetooth test, acoustic measurement of Wireless
    RSM for LMR radio and mobile – year 2013 to 2014.
  • Support system test and acoustic test
    measurement for OEM (Temco) products – year
    2015 to 2016.
  • Design SAM (speaker As Mic) and support acoustic
    measurement in high tier RSM for APX radio – year
    2019 to 2020.
  • With cross-team leadership experience as an
    Electrical Engineering (EE) Lead for wireless RSM
    and wireless POD in LTE radio from 2018 to 2021, I
    effectively coordinated with multiple stakeholders,
    including regulatory labs, project managers,
    factories, TSE, TOP, sourcing teams, business units,
    architects, software and mechanical teams, and
    quality assurance groups. My role was to ensure
    that all aspects of the project aligned with its goals
    and timelines, driving successful outcomes through
    strategic collaboration and leadership.
  • Familiar with product test flow (front end and back
    end) in the factory. Experience in factory
    documentation for method specification of the
    product. Always work closely with TSE and TOP for
    critical parameters check of product functionality,
    design the front-end and back-end functionality
    tests of product in the factory (board level test,customer interface test, Bluetooth test, acoustic
    test). Provide on-site DE support during the build.
  • Have substantial experience in PCB schematic
    drawing and PCB layout.
  • Have substantial experience using NI LabVIEW to
    develop automation tests, including battery life
    assessments, audio breakthrough evaluations, and
    voltage measurements with multimeters. These
    automated tests have been applied to a wide
    range of accessory products, significantly
    enhancing both test efficiency and accuracy. My
    work in this area has contributed to streamlined
    testing processes and improved reliability of
    product evaluations.
  • Have extensive experience conducting electrical
    engineering system tests, including functionality,
    desense, chopper noise, audio compatibility, and
    electrostatic discharge (ESD) evaluations, for a
    range of wired and wireless radio accessories.
  • Have extensive experience conductiong
    accessory acoustic measurement (Mechanic
    TX/RX, OTA TX/RX, audio safety, max loudness,
    microphone beamforming, speaker response, over
    the air receiving, speaker loudness, microphone
    fail detection, pass alarm post filtering, cardioid
    polar response, idle channel noise, hum and noise,
    speaker crest factor and audio feedback)
  • Experience in SAM (speaker as mic) design.
  • Experience in audio breakthrough test.

RGB Sdn Bhd

Technical Support Engineer
08.2009 - 03.2010

Job overview

  • Less than 1 year of working experience in Technical Support Team.
  • Support machine/system hardware/signage/mystery & progressive jackpot installation.
  • Provide repairing/servicing/maintenance of gaming machine at both local entertainment club/star cruise and oversea casino hotel (Thailand, Vietnam, Laos & Cambodia)
  • Provide on-site technical support to minimize the machine down time.
  • Do refurbishment of gaming machine (table and slot machine).
  • Support system installation (SIP Jackport Link, Paltronic Jackpoct Link, Smartlink and KISS).
  • Work independently at new customer site to complete installation of Jackpot machine and system at SKKS club at Thakek, Laos

Education

UNIVERSITY TECHNOLOGY MALAYSIA
, Skudai, Johor, Malaysia

BACHELOR OF ELECTRICAL ENGINEERING (POWER)
04.2001

University Overview

  • Dean's List, [Semester I/II, 2005/2006]
  • Dean's List, [Semester II, 2006/2007]
  • Dean's List, [Semester I, 2007/2008]
  • Dean's List, [Semester I/II, 2008/2009]

Skills

Analytical Skills

Patents Awards

Filed US20210051449A1

Programming/ Scripting

LabVIEW

Visual Studio (Torch)

Applications

Microsoft Office Tools

JMP

TOS (Tester Operative System)

TINA (TI simulation tool)

Cadence Design System Tools

Languages

English
Upper intermediate
B2
Chinese (Mandarin)
Advanced
C1
Chinese (Cantonese)
Upper intermediate
B2
Malay
Upper intermediate
B2

Interests

Workout

Movie / Music

Drawing

Work Preference

Work Type

Full Time

Work Location

On-SiteHybrid

Important To Me

Work-life balanceCareer advancementCompany CultureHealthcare benefitsTeam Building / Company Retreats

Timeline

Senior Product Development Engineer

Intel Microelectronics (M) Sdn. Bhd
03.2022 - Current

Senior Electrical Engineer

Motorola Solutions Inc
06.2010 - 03.2022

Technical Support Engineer

RGB Sdn Bhd
08.2009 - 03.2010

UNIVERSITY TECHNOLOGY MALAYSIA

BACHELOR OF ELECTRICAL ENGINEERING (POWER)
04.2001
Chee Beng NgSENIOR PRODUCT DEVELOPMENT ENGINEER