Busrin Bin Bahauddin

• Responsible for equipment set-ups, calibrations, and preventative maintenance schedules.
• Troubleshot and repaired circuit boards to the component level using multi-meters, oscilloscopes, and power supplies.
• Perform Reworks and Debug WIP in timely manner base on client request.
• Participated in team meetings and training to enhance quality practices.

Perform rework and repair execute WIP in timely manner base on client request.

• Level 1- Hand soldering.
• Level 2- BGA, Press-fit, Solderpot.
• Level 3- Major rework, Lifted pad, Traces cut.

• Returns material authorization (RMA) specialist.
• Document data, analyze and identify trends in repair and replacement request by customer.
• Organize on-time shipments of replacement and/ or repaired customer products according to company services guidelines.
• Daily review of product backlog/inventory executive summary report creation.

• Tellabs (Coriant) Product based on Networking PCBA
• Broadcom (Avago) Product based on PCIe card PCBA
• Troubleshooting and repairs ICT's & Functional's test boards down to component level.
• Familiar with Fibre Optic & hardware/software.
• Knowledge schematic/ block diagram, multi-meter, oscilloscope.
• Maintains or reduced WIP that had failed.
• Programmed of boards.
• Documented data of failures and repairs.
• Interfaced with Engineers and Assamble's .