Bavani A/P Chellaiah

Process Sustainability & Lot Disposition

• Acquired solid working knowledge of wet tool operation and maintenance, including critical parameters such as flow rate, chemical temperature, process time, pressure, and recipe logic.
• Gained operational knowledge of wet tools, including monitoring flow rate, chemical temperature, timing, and pressure parameters.
• Provided key support for ANKO tool and process qualifications, as well as evaluations related to defect density, VPD, and etch rate performance.
• Acquired knowledge in recipe creation and optimization for improved process yield and stability across multiple products.
• Successfully closed multiple QMP cases by resolving tool-related issues such as wafer breakage, process abort, limit exceedance, and space violations.
• Monitored and optimized production processes to increase throughput and improve quality.
• Contributed support during power trip recovery, leading lot risk assessments, disposition, and post-trip qualification.

Tool Qualifications & Root Cause Investigations

• Led and executed process qualifications for two frontend full flow cleaning and etching tools (Mercury) including recipe validation, test wafer runs, and metrology correlation.
• Served as main support for process qualification and acceptance testing, ensuring compliance with engineering specs and tool readiness for production release.
• Collaborated closely with vendors and equipment engineers to analyze tool issues, test results, and process abnormalities during qualification phases.
• Developed understanding of wafer surface conditions, particle defect trends, and their correlation with tool performance.
• Proactively involved in root cause analysis of persistent defect density failures during tool qualification, identifying critical contamination sources and flow rate mismatches.
• Performed Equipment Integration (EI) testing to evaluate process change impact on product yield and reliability.
• Monitored and optimized production processes to increase throughput and improve quality.

DOE (Design of Experiment)

• Contributed in a project to resolve wafer scratching in Nanospray tools caused by robot chuck pin retraction delays; implemented optimized motion parameters and recipe changes, eliminating mechanical damage.
• Supported in chemical parameter testing to optimize TEOS etch rate; identified key variables impacting uniformity and supported recipe adjustments for improved etch consistency.