ARVIND PARAMASIVAM
Process Engineer
Butterworth
Summary
To secure a challenging position in a reputable organization to expand my learnings, knowledge and skills. Secure a responsible career opportunity to fully utilize my training and skills, while making a significant contribution to the success of the company.
Knowledgeable Process Engineering with strong foundation in process optimization and efficiency improvements. Demonstrated success in streamlining operations and enhancing product quality. Proven ability to apply analytical thinking and problem-solving skills in dynamic environments.
Overview
7
7
years of professional experience
8
8
years of post-secondary education
4
4
Languages
Work History
PROCESS ENGINEER (WETS/CLEAN TECH)
GLOBAL FOUNDRIES MALAYSIA
10.2024 - Current
- Daily task execute by remote desktop.
- Sustain setup or production line SPC/FDC (Statistical process control/fault detection classification) monitoring, CPK improvement, Qualification and troubleshooting support for process and tool issues by remote work.
- Support Process Engineer for any process issue or process abort by analyze the parameter of tool and proceed for wafer rework.
- Monitor & analysis the defects feedback system (DFS) and update feedback to CFM by performing particle check (PC) on the tool.
- Work out with MT’s after PM Qualification, CM Qualification or any Scratch test before bring up tool to Production Mode.
- Work with cross functional teams, and cross fabs for BKM (best known method) convergences on recipes, material, method and automation.
- Support company’s production ramp schedule by process qualification, productivity improvement and new tool release.
- Monitor daily for automative and security lot and handle carefully without any defect or scrap.
- Perform qualification if any abnormal or out of control on the SPC by using SAP tool to optimize the SPC back to the baseline following the OCAP.
- Manage Jeopardy Inhibit (LG), Exception Inhibit, Tool Inhibit for Single Wafer Tool, Batch Wafer Tool, Scrubber Tool, LAM Tool & Aerosol Tool if any suspicious defect on wafer and align with Process Engineer and Maintenance Technician.
- Review Operation Route from each process layer for Defect Inspection /Defect Review as per request by CFM team.
- Monitor Bottleneck List for any Top Priority tool for the FAB and also for daily wafer moves to ensure minimize work in process (WIP) and also for QTime Lot.
- Raise MRB or Icase if any incident for lot wafer breakage, automotive lot and major scratch as per request by the Process Engineer.
- Successfully achieve Yellow Belt in Lean Six Sigma.
- Successfully participate in IATF audit and gain certification for Hubs Operation.
- Achieve Excellence Global Operation CEO Award 2024.
Product Development Technician 2 (Die Attach/SMT REFLOW)
TF-AMD MICROELECTRONICS SDN BHD
08.2022 - 10.2023
- Specialist in Surface Mount Technology (SMT) and Single Reflow in create New Product Introduction (NPI) for Advance Packaging for AMD.
- Follow up New Product Introduction (NPI) engineering build and monitor the packaging with zero defect.
- Create Program for process automation flow transaction or called as One Touch Automation (OTA).
- Monitor the logistics for new product material from die prep until complete assembly process following the CAMSTAR.
- Investigate the defect or CNW in unit packaging and perform 8D documentation report for MRB meeting presentation.
- Audit all the usage assembly kit material for solder print (DEK), chip cap (Fuji NXT), die chip flux (Datacon) and single reflow system (Heller) before performing the new build assembly.
- Create program using Recipe Management System (RMS), Material Management System and ICT configuration.
- Perform DOE for LVM product before handle for mass production.
- Collect data during assemble for new build product and key in the data Statistical Process Chart (SPC) by using Datalyzer for AMD Quality audit.
- Inspect the condition of die chip and package by using 150x microscope to avoid any defect or contamination.
- Buyoff wet Xray after die chip assembly (using Datacon Machine system) & dry Xray after single reflow (from Heller or B2U reflow machine system) to ensure the bump between die and package are in correct position before start the engineering build process.
- Perform and inspect the assemble unit die thickness with package by using SOH surface microscope laser (control in µm) to ensure meet the quality specification.
- Perform IR inspect to every die to avoid any die chipping out that cause the quality defect that effect the build performance.
- Successfully operate Nokia for 4th batch by approval from Nokia customer.
- Successfully obtain OBERON as zero defect as convert as mass production approval from AMD.
- Successfully obtain Navi32 to run as LVM product approval from AMD.
Sputter Process Technician 3
Western Digital Cooperation
06.2018 - 08.2023
- Assist Sputter Process Engineers in executing engineering evaluation and process data compilation.
- Regular Process monitoring OLSPC system and make adjustments in accordance to process flow. Execute out engineering evaluation and process data compilation.
- Irregular IMS Audit preparations and compliance New product, process documentation, OLSPC administration.
- Monitor Guzik (Magnetic recording) results closely and advise and trigger sputter process for tuning accordingly whenever necessary.
- Participate in improvement projects including productivity improvement, process improvement, and quality improvements.
- Responsible in benchmarking on a continuous basis among internal and external disk and be involved in product comparison.
- Assist with Engineer to monitor KPIV performance and make adjustment power to optimize it.
- Update and highlight Process Engineer if any error happen during operation.
- Prepare 8D report documentation if any HDD issue happen.
- Execute process engineering documentation and regular reports.
- Assist with engineer troubleshooting during process issue and process conversion.
- Develop direct reports by providing challenging tasks and assignments; provide developmental feedback.
- Daily Meeting with QA Engineer & Technician and briefing improvement of process to meet to quality of HDD.
Education
DIPLOMA - MECHANICAL ENGINEERING
LINTON COLLEGE UNIVERSITY
NILAI, NEGERI SEMBILAN 01.2014 - 01.2017
BACHELOR - MANUFACTURING MANAGEMENT WITH HONOURS
Open University of Malaysia
Sungai Petani, Kedah 01.2018 - 01.2023
Skills
- Process improvement
- Quality control analysis
- Equipment and process operation and control
- Regulatory compliance
- Systems analysis
- Complex problem-solving
- Equipment selection
- Equipment maintenance
- Computer competence in Windows PowerPoint
- Microsoft Word
Process flow analysis
Continuous improvement
Root-cause analysis
Process flows
Process development
Process mapping
Documents and reports
Improvement tracking
ISO 9001 compliance
Manufacturing improvement
Communication Skills
- Excellent written and verbal communication skills.
- Confident, articulate, and professional speaking abilities (and experience).
- Empathic listener and persuasive speaker.
- Writing creative or factual.
- Speaking in public, to groups, or via electronic media.
- Excellent presentation and negotiation skills.
Timeline
PROCESS ENGINEER (WETS/CLEAN TECH)
GLOBAL FOUNDRIES MALAYSIA
10.2024 - Current
Product Development Technician 2 (Die Attach/SMT REFLOW)
TF-AMD MICROELECTRONICS SDN BHD
08.2022 - 10.2023
Sputter Process Technician 3
Western Digital Cooperation
06.2018 - 08.2023
BACHELOR - MANUFACTURING MANAGEMENT WITH HONOURS
Open University of Malaysia
01.2018 - 01.2023
DIPLOMA - MECHANICAL ENGINEERING
LINTON COLLEGE UNIVERSITY
01.2014 - 01.2017
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