Anbuarasan John Rayappan
Summary
No.17 , Jalan Melaka Baru 2/2,
Taman Melaka Baru Fasa 3,
75450 Batu Berendam ,
Melaka.
10th June 2024
Dear Sir/Madam,
Subject: Application for Director /Snr Manager Process/ Equipment Engineering
I understand that your company currently has an opening for above mentioned positions, please find my CV Starting out my career with Shin-Etsu Sdn Bhd 24 years ago has been a very rewarding experience. I gained invaluable skills and knowledge as a QA Engineer into handling both equipment and human aspect of my profession with much success.
Venturing into the Semiconductor Industry more than 23 years as a Field Service Engineer has broadened my knowledge of the “High-Tech” world we live in now. Being an electronic gadget craze myself (interested in the rapid advancement of technology in the electronics world), I found myself gaining more interest into understanding and contributing my services to the Microelectronics/ Semiconductors world.
I started to explore out on green technology knowledge by joining Solar -Q-Cells (M) Sdn Bhd in June 2008 as a pioneer team for solar cells fabrication. With an experience of 2 years in solar cell fabrication industry, I have gained substantial knowledge of how solar cells have made significant impact to our environments.
Venturing into Front End wafer Fab, Infineon Technologies provides line sustaining challenges while First Solar offers an excellent new start-up technology from San Jose, California. Lastly with Osram Opto Semiconductor start-up offers another horizon in frontend LED technology start up Wafer Fab and towards new technology in the world of microLED.
I have completed my MBA, my ability to understand the operational principles of the equipment/processes and further applying this knowledge to maintaining the systems has helped me greatly in my management and leadership profession.
However, I also understand that I need to acquire more knowledges to help me excel in my profession and fulfil my inquisitive mentally. Although I have indicated that I have a strong desire to improve myself academically, I would like to assure you that work is still my top priority and my academic pursue is to better equip myself for the profession that I have chosen.
In my current search for a career advancement opportunity, I am seeking an opportunity to further enhance my knowledges and exposures in the industries and growth in management and leadership levels. Attached herewith is my CV
Overview
25
25
years of professional experience
5
5
years of post-secondary education
10
10
Certifications
Work History
Function Head ( Director )
Osram Opto -Semiconductor (Kulim) Sdn Bhd
Kulim
11.2021 - Current
- Engineering Module 2: Plasma Etch & Ashing , Thermal ( Annealing & ALD ) , Metallization ( Sputtering & Evaporation ) , PECVD
- Key Responsibilities
- Managing and leading a group of managers (3x), process and Equipment engineers (21X) with technicians(24X)
- Newly recruit the entire teams for called Topaz -Micro LED under Module 2
- Building a high-performance team, fostering cross functional teams collaborations within local and Germany
- Managing and handling tool purchases including all sub tools Capex ~120mil Euro for the startup of new 8” micro-LED under Module 2
- Responsible for setting up Topaz 8” micro-LED with new technology transfers, procurement of new equipment, start-ups, and process qualification till releases to manufacturing
- Monitor and track all KPI’s within module, streamline to organizational and business growth
- Responsible for overall tool Capex, forecasting all sub tools and planning for the startup schedules to meet customer demands
- Responsible for module cost top-down evolving maintenance and engineering
- Define budget, headcount and cost-down target through operational efficiency and productivity
- Creates “Environmental Sustainability” through evaluating new abatement systems to reduce CO2 as part of customer requirements
- Develop and execute strategy, set goals, milestones, projects and directions for all managers and engineers
- Plan and execute Regensburg training plan for all managers, engineers, and technicians for 6-7 months OJT, Including VISA preparation, MIDA submission for claims and travelling of teams to Germany
- Completed all documentations and transfer successfully from Pilot Line in Germany to Kulim FEK2
- Startup with move-in of equipment’s, hook up of all tools and integrated with hardware and process startup as to be released in end-May’23 with 1st wafer out for customer sample build
- Provide guidance, mentorship and professional development opportunities to team members
- Delegate tasks to maintain strategic focus among production and engineering teams
- ACCOMPLISHMENT:
- Pioneer start-up team of FEK2 Topaz micro-LED 8” Project
- Start-up and ramp of micro-LED 8” (frontier technology)
Department Head: Operation & Engineering Module Manager
Osram Opto -Semiconductor (Kulim) Sdn Bhd
Kulim
05.2017 - 11.2021
- Plasma & Thermal and Polished Sapphire Substrate( PSS)
- Key Responsibilities
- Managing and leading a group of operational shift engineers (6X) and manufacturing assistance (96X), processes and equipment engineers (10X) with technicians(18X)
- Recruit employees, assign, direct, and evaluate their work; and oversee the development and maintenance of staff competence
- Responsible for process performances in plasma etching/ dicing, PECVD deposition, Ashing and Thermal (Annealing and ALD) operations
- Drive technical line topics, new technology transfer from Regensburg and develop detailed cost estimates and project schedules
- In-depth knowledge both in process and maintenance platform
- Responsible for new technology transfers, procurement of new equipment, start-ups and process qualification till releases to manufacturing
- Drive and responsible for maintenance systems optimization and improvements through 2nd source parts, design change and drive continuous quality
- Responsible for Uptime (OEE), Process Capability (Cpk) Line Excursion and Yield targets for Department
- Develop and execute strategy, set goals, milestones, projects
- Lead, guide and coach equipment engineers in all technical and processing aspects
- Develop individual associates according to their strengths
- Responsible and control for FEM (Penang & Kulim Plant) Spares Inventory Reduction program
- Works from highly complex test procedures, electro – mechanical schematics, diagrams, written and /or verbal descriptions and layouts, or with little or no formally released documentation
- Responsible for departmental continuous quality improvement programs such as ISO pre-audits, wafer scrap reduction, yield improvement, tool upgrades, maintenance cost sustaining, CAPEX, repair and calibration by using SAP systems
- Responsible for module cost top-down evolving maintenance and engineering
- Define budget, headcount and cost-down target through operational efficiency and productivity
- Responsible for Operational KPI’s ie , Flow Factor ( FF) , Cycle time( CT ) and Alpha and streamline operational issues with flow integration
- ACCOMPLISHMENT:
- Pioneer start-up team of Osram Kulim Front-End Opto- Semiconductor Wafer Fab
- Start-up and ramp Santos 2000wspw and UX3 2800wspw technology successfully
- Workstream Lead for PIP projects (FE Cost Santos €' 3.27mil) for FY 19/20
- Lead in Polished Sapphire Substrate (PSS) ICP Technology transfer FY 19/20
- Lead in FEK Spare Inventory Reduction (~€' 1mil) FY18/19
- Site Key-Expert for CEPT – New Equipment Purchase Board Member
- Achieved Module Top-Down Cost Saving (~€'0.414mil) in FY18/19
- Lead project for ATK and HK for IDL Headcount Productivity and Global Spares
- Equipment Council representing overall FEK
Senior Principle Engineer
First Solar (Malaysia) Sdn Bhd, First Solar
Kulim
04.2014 - 05.2017
- Managing and lead group of automation engineers and technicians comprising both robotics and conveyor systems
- Responsible for TetraSun equipment move-in, installing and commissioning of tools
- Work closely with Corporate Engineering group in planning and executing all facilities related work with M+W vendor
- Pre-planning of maintenance tool purchases including RGA, leak detectors, High Speed camera, Explosion proof vacuum cleaners, metrology tools and other ancillary items
- Drive and responsible for maintenance systems optimization and improvements in MES Fab Eagle
- Drive and responsible for automation tool acceptance (FAT) with closing and meeting KPI’s criteria and issues e.g
- Tool availability, Yield
- Involved together with TTS team for automation (Jonas & Redmann) SAT in Germany
- Met overall Uptime (>98%) and Yield targets (1.08%) for Automations in Q1, Q2’16
- Drive and responsible for setting up TTS maintenance bay with common parts purchased, stocking of all loose parts from equipment’s and creation of functional areas of parts repairing and cleaning such as valves, pumps.etc
- Lead, guide and coach equipment engineers in all technical and process aspects
- Develop individual associates according to their strengths
- Established an E-catalogue spare parts management systems for all equipment spares in the warehouse
- Responsible and control for TTS Spares Inventory at USD 1.5mil
- Manpower placement, recruitment & training of concerned personal including Internship
- Pioneer in Series 6 design phase in automation and robotics, decommissioning of current Series 4 Line and startup in house Fanuc Robotics Service Centre to refurbished Fanuc robots
- Works from highly complex test procedures, electro – mechanical schematics, diagrams, written and /or verbal descriptions and layouts, or with little or no formally released documentation
- Responsible for departmental continuous quality improvement program such as ISO pre-audits, wafer scrap reduction, yield improvement, tool upgrades and maintenance cost sustaining
- First Silicon Cell with Efficiency of 21.3% in Nov-2014
- Project Lead for M2 Large Wafer Format implementation in TTS Fab
- Completed SAT & FAT for all Automation tools ( J&R Automation )
- Completed TTS - Equipment tool PC image (O/S) backup management
- Completed Equipment Software Version Control (ESVC)
- Established In-house carrier repair Centre.
Back End Manager
Infineon Technologies ( Kulim ) Sdn Bhd
Kulim
08.2010 - 04.2014
- M4 Etch Module
- Key Responsibilities
- Managing and lead group of 10 maintenance engineers and 40 shift technicians
- Responsible for Maintenance operation of Back End Etch tools comprising of Gasonic Ashing , Mattson Ashing , Lam Rainbow 4520i Oxide etcher , TEL DRM Anisotropic Etch , TCP9600SE Metal Etch systems
- A total of 72 equipment’s for Back End Fab
- Planning for all startup of equipments systems as per CAPA together with OPC
- Manage equipment moves, startup and commissioning and decommissioning, as production needs change
- Drive and responsible for enforcing and implementing continuous improvement, process simplification and cost avoidance projects
- Lead, guide and coach equipment engineers in all technical and process aspects
- Establishes long range and short-range goals and objectives in maintaining an equipment management program
- Provides resource management and control, including staffing, functional repair parts and supplies, and purchased services required to maintain the equipment in operable condition and in a safe environment
- Manpower placement, recruitment & training of concerned personal
- Responsible for the financial viability of the department
- Develops the annual cost per toolbox and insures meeting the target setting
- Partner with Facilities / Operation/ Technology / IT to ensure existing and new equipments is facilitated, installed & operated in compliance with all applicable local and corporate laws
- Works from highly complex test procedures, electro – mechanical schematics, diagrams, written and /or verbal descriptions and layouts, or with little or no formally released documentation
- Familiar with SAP for maintenance, spare parts and calibrations processes
- Responsible for departmental continuous quality improvement program such as wafer scrap reduction, yield improvement and maintenance cost sustaining
- ACCOMPLISHMENT:
- YIP (Your Idea Pays) recognition and Top YIP contributor 2010/11
- IFKM Technical Symposium Poster 2012 – 3RD runner up
- Improved wafer skating in Gasonic temperature platen through star-groove pattern design
- ToQ – Sliver Award: "DMAIC for LAM TCP9600, Metal Etch chamber Defect Density improvement"
- ToQ – Sliver Award: "DMAIC for LAM TCP9600, Metal Etch chamber average MTBC improvement"
- ToQ – Gold Award: “Continuous Improvement for Ashing WorkCentre".
Head of Equipment Engineering
Q-Cells (Malaysia) Sdn Bhd
Sepang Selangor
06.2008 - 08.2010
- (Equipment ,Automations, Measurement)
- Key Responsibilities
- Pioneer startup team of 600MWp solar cell fabrication plant in Sepang, Selangor Science Park 2
- Managing and lead Equipment Engineering, Automation and Measurement group consisting 2 Team Leads and 15 engineers
- Responsible for design and implementation of new automation for MYQ plant
- Master planning for all startup of equipments, automation and inline measurement systems
- Manage equipment moves, startup and commissioning and decommissioning, as production needs change
- Drive and responsible for enforcing and implementing continuous improvement, process simplification and cost avoidance projects
- Lead, guide and coach equipment / measurement / Automation manager and engineers in all technical aspects
- Establishes long range and short-range goals and objectives in maintaining an equipment management program
- Provides resource management and control, including staffing, functional repair parts and supplies, and purchased services required to maintain the equipment in operable condition and in a safe environment
- Manpower placement, recruitment & training of concerned persons
- Responsible for the financial viability of the department
- Develops the annual budget and ensures that the department functions within that budget
- Provides recommendations on technology management and capital equipment budget issues
- Partner with Facilities / Operation/ Technology / IT / Maintenance engineering to ensure existing and new equipments is facilitated, installed & operated in compliance with all applicable local and corporate laws
- Analytical; Organized; Effective Communicator across functionally to peers and management
- Works from highly complex test procedures, electro – mechanical schematics, diagrams, written and /or verbal descriptions and layouts, or with little or no formally released documentation
- Responsible for departmental continuous quality improvement program such as scrap reduction, yield improvement
- Establishes training needs assessment and development of the Annual Training Plan
- ACCOMPLISHMENT:
- Completion startup of 600MWp solar cell fabrication plant and released to production within stipulated time schedule.
Senior Equipment Engineer
National Semiconductor Sdn Bhd
Melaka
09.2001 - 05.2008
- Pioneer in Wafer Bump start-up in Plasma Etcher, Sputtering , Wet Etcher , Ball Mount and Reflow ( BGA ) application .
Employee Incentive Plan, KEIP
01.2005 - 01.2008
- In –charge of Bump LLP equipment line and converted to a clean room area
- Substitute wafer transport system from belt driven to timing chain in Sputtering system
- Implemented and converted Direct cooling into In-Direct cooling for Al magnetron on sputtering system due to Al heat expansion during sputtering
- Implemented and converted Reflow oven wafer loader from conventional V+ programming to PLC programming
- Cost saving of 86% compare buying an original wafer loader form OEM
- Cost saving in N2 usage
- Drive whole plant project for N2 usage on equipment
- Cost saving of 47% for wafer bump area
- Introduce and implement auto –shut off screen for wrong ball size top up
- Well control in production line and driving to zero Yield losses due to this problem
- Planning maintenance schedule for system in charge
- Controlled over Spare parts Inventory
- Conducted system training to new hired Engineers and Technicians
- Introduced new ball attached system for strip level packaging (Bump LLP)
- Expanded Role to process knowledge for plasma (RF and MW) , sputtering, ball mount and reflow oven
- Implemented BKM (Best known Method) to optimize the equipment
- Implemented process improvement to the existing ball attached and reflow oven processes
- Well verse in both process and equipment for system in charge
- ACCOMPLISHMENT:
- Champion / Team Leader for Dry area (Plasma, Sputtering, Ball Mount & Furnaces) during wafer bump startup
- Completed installed and released to production within set timeline
- Silver Award – Wafer Bump cost improvement
- Gold Award – Wafer bump chemical savings
- Gold Award – 1st Fab level Development project: 5um Cu-Top
- Silver Award – Exceptional cost saving of N2 reduction.
Field Service Engineer
Lam Research Corporation
01.2000 - 09.2001
- Pioneer in Setup and installed of Lam Etcher’s in Silterra including 9600PTX ( Metal etcher) , 9400PTX ( poly etcher ) and Exelan ( oxide etcher)
- Successfully setup and installed 4 metal etcher and 3 poly/ hybrid etchers in Silterra, Kulim
- Installed and setup 4X Metal Etcher in TSMC, Singapore
- Meet all the process requirement set by the customer
- Obtained tool acceptance from customer
- Providing 24 x 7 local Technical supports to customer
- Competence and Certified in Handling and repairing Brooks Mag 7 Robot
- To provide timely and effective solution to the customer to keep the tool running.
Quality Control Engineer
Shin Etsu Sdn Bhd
06.1999 - 12.1999
- Qualified and released to production ADE (thickness measurement) and Raytex ( wafer edge inspection system)
- Involved in the whole plant projects for Yield improvements
- Carried out studies “ How the ingot crack “ in terms of orientation at Ingot sawing area
- Been part of the team for Quality Control in production line
- Involved in ISO 9000 training and setup.
Field Service support
Lam Research Corporation, LSI Logic
Fremont, Portland, California, Oregon
- Technology transfer team (3 months) from, (4 months) in Philips CMOS 4, Nijmegan, The Netherlands
- Plasma Matrix Bobcat training in Sacramento, California
- Auto Ball Drop System training at Shibuya, Japan
- Nexx sputtering system training in Boston, USA
- Tempress System - Plasma Etcher -RIE & ICP System (, )
- Lead Equipment Engineering team OJT in Germany for 3 months.
Education
Master’s - Business administration
Anbuarasan John Rayappan
05.2011 - 12.2012
Bachelor of Technology - Quality Control and Instrumentation
University Science Malaysia
01.1996 - 01.1999
MBA - Human Resources Management
Skills
Discovery of Inner selfundefined
Certification
TetraSun Technology Transfer (12 weeks) from San Jose, California.
Timeline
Function Head ( Director )
Osram Opto -Semiconductor (Kulim) Sdn Bhd
11.2021 - Current
Department Head: Operation & Engineering Module Manager
Osram Opto -Semiconductor (Kulim) Sdn Bhd
05.2017 - 11.2021
Senior Principle Engineer
First Solar (Malaysia) Sdn Bhd, First Solar
04.2014 - 05.2017
Master’s - Business administration
Anbuarasan John Rayappan
05.2011 - 12.2012
Back End Manager
Infineon Technologies ( Kulim ) Sdn Bhd
08.2010 - 04.2014
Head of Equipment Engineering
Q-Cells (Malaysia) Sdn Bhd
06.2008 - 08.2010
Employee Incentive Plan, KEIP
01.2005 - 01.2008
Senior Equipment Engineer
National Semiconductor Sdn Bhd
09.2001 - 05.2008
Field Service Engineer
Lam Research Corporation
01.2000 - 09.2001
Quality Control Engineer
Shin Etsu Sdn Bhd
06.1999 - 12.1999
Bachelor of Technology - Quality Control and Instrumentation
University Science Malaysia
01.1996 - 01.1999
Field Service support
Lam Research Corporation, LSI Logic
MBA - Human Resources Management
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